DMP1080UCB4
Document number: DS35827 Rev. 5 - 2
May 2015
© Diodes Incorporated
Maximum Ratings (@T
A
= +25°C, unless otherwise specified.)
Continuous Drain Current (Note 5) V
GS
= -4.5V
Continuous Drain Current (Note 5) V
GS
= -2.5V
Pulsed Drain Current (Note 6)
Thermal Characteristics
Power Dissipation (Note 7)
Thermal Resistance, Junction to Ambient @T
A
= +25°C (Note 7)
Thermal Resistance, Junction to Case @T
C
= +25°C (Note 7)
Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient @T
A
= +25°C (Note 5)
Operating and Storage Temperature Range
Electrical Characteristics (@T
A
= +25°C, unless otherwise specified.)
OFF CHARACTERISTICS (Note 8)
Drain-Source Breakdown Voltage
Gate-Source Breakdown Voltage
Zero Gate Voltage Drain Current T
J
= +25°C
ON CHARACTERISTICS (Note 8)
V
DS
= V
GS
, I
D
= -250μA
Static Drain-Source On-Resistance
V
GS
= -4.5V, I
D
= -500mA
V
GS
= -2.5V, I
D
= -500mA
V
GS
= -1.5V, I
D
= -500mA
Forward Transfer Admittance
V
dd
= –4.0V, I
F
= –0.5A,
di/dt =100A/μs
DYNAMIC CHARACTERISTICS (Note 9)
V
DS
= -6V, V
GS
= 0V,
f = 1.0MHz
Reverse Transfer Capacitance
V
GS
= -4.5V, V
DS
= -6V,
I
D
= -500mA
V
DS
= -6V, V
GS
= -2.5V,
R
G
= 20Ω, I
D
= -500mA
Notes: 5. Device mounted on FR4 material with 1-inch
2
(6.45-cm
2
), 2-oz. (0.071-mm thick) Cu.
6. Repetitive rating, pulse width limited by junction temperature.
7. Device mounted on FR-4 PCB with minimum recommended pad layout, single sided.
8. Short duration pulse test used to minimize self-heating effect.
9. Guaranteed by design. Not subject to production testing.