HBL5006 Series
http://onsemi.com
5
DEVICE ORDERING INFORMATION
Device Marking Package Shipping
†
HBL5006HT1G HD
SOD−323
(Pb−Free)
3000 / Tape & Reel
SZHBL5006HT1G* HD
HBL5006XV2T1G 56
SOD−523
(Pb−Free)
3000 / Tape & Reel
SZHBL5006XV2T1G* 56
HBL5006P2T5G LD
SOD−923
(Pb−Free)
8000 / Tape & Reel
SZHBL5006P2T5G* LD
†For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
*SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP
Capable.
PACKAGE DIMENSIONS
SOD−323
CASE 477−02
ISSUE H
H
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. LEAD THICKNESS SPECIFIED PER L/F DRAWING
WITH SOLDER PLATING.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
5. DIMENSION L IS MEASURED FROM END OF RADIUS.
NOTE 3
D
1
2b
E
A3
A1
A
C
NOTE 5
L
H
E
DIM MIN NOM MAX
MILLIMETERS
A 0.80 0.90 1.00
A1 0.00 0.05 0.10
A3 0.15 REF
b 0.25 0.32 0.4
C 0.089 0.12 0.177
D 1.60 1.70 1.80
E 1.15 1.25 1.35
0.08
2.30 2.50 2.70
L
0.031 0.035 0.040
0.000 0.002 0.004
0.006 REF
0.010 0.012 0.016
0.003 0.005 0.007
0.062 0.066 0.070
0.045 0.049 0.053
0.003
0.090 0.098 0.105
MIN NOM MAX
INCHES
1.60
0.063
0.63
0.025
0.83
0.033
2.85
0.112
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
