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SZHBL5006P2T5G

P1-P3P4-P6P7-P7
© Semiconductor Components Industries, LLC, 2014
August, 2014 − Rev. 0
1 Publication Order Number:
HBL5006/D
HBL5006 Series
LED Shunt
The HBL5006 Series are electronic shunts which provide a current
bypass in the case of LEDs going into open circuit. LEDs are by nature
quite fragile when subjected to transients and surge conditions. There
are also many cases where high reliability of the LED lighting must be
maintained such as in headlights, lighthouses, bridges, aircraft, runways
and so forth. In these cases the low cost addition of the shunt device will
provide full assurance that an entire string of LEDs will not extinguish
should one LED fail open. The shunt device is also applicable to other
loads where circuit continuity is required. The devices are designed to
be used with LED string currents from 50 to 350 mA.
Features
• Protection for the Following IEC Standards:
IEC 61000−4−2 (Level 4)
ISO 10605
• Low ESD Clamping Voltage
• Automatically Resets Itself if the LED Heals Itself or is Replaced
• ON−State Voltage Typically 1.1 V
• OFF−State Current less than 1.0 mA
• SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
• These Devices are Pb−Free and are RoHS Compliant
Typical Applications
• LEDs where Preventive Maintenance is Impractical
• LED Headlights in Automobiles
• Automotive LED Applications
• LEDs with High Reliability Requirements
• Crowbar Protection for Open Circuit Conditions
• Overvoltage Protection for Sensitive Circuits
http://onsemi.com
Control
Circuit
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
ORDERING INFORMATION
MARKING
DIAGRAMS
XX = Specific Device Code
M = Date Code
SOD−323
CASE 477
SOD−523
CASE 502
SOD−923
CASE 514AB
HD
M
56
12
M
LD M
+
−
HBL5006
1
2
1
2
HBL5006
1
2
Apply heat sinking to pin 2
ESD
HBL5006 Series
http://onsemi.com
2
MAXIMUM RATINGS
Rating Symbol Value Unit
On−State Current, (T
A
= 25°C) (Note 2) SOD−323 (Note 1)
SOD−323 (Note 2)
SOD−523 (Note 1)
SOD−523 (Note 2)
SOD−923 (Note 1)
SOD−923 (Note 2)
I
T(AVG)
250
200
300
250
350
300
mA
Thermal Resistance, Junction−to−Air (All Packages) SOD−323 (Note 1)
SOD−323 (Note 2)
SOD−523 (Note 1)
SOD−523 (Note 2)
SOD−923 (Note 1)
SOD−923 (Note 2)
q
JA
435
550
360
435
285
360
°C/W
Operating Temperature Range (Note 3) T
J
−40 to 150 °C
Non−Operating Temperature Range T
J
150 °C
Lead Temperature, Soldering (10 Sec) T
L
260 °C
IEC 61000−4−2 Contact (ESD)
IEC 61000−4−2 Air (ESD)
ESD
ESD
±15
±15
kV
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Mounted onto a 2−layer, 1000 mm
2
per layer, 3 oz Cu, FR4 PCB with pin 2 connected to the heat sink and pin 1 only connected to a signal
trace. The heat sinking must be connected to pin 2, which is the LED cathode connection.
Normally this device would be mounted on the same copper heat sink and adjacent to the LED(s). If the LED(s) were to go open, then the
HBL shunt would now dissipate the power using the same copper heat sink. Since the shunt has a voltage that is nominally 30% of the LED,
then the power dissipation would be much lower, and easily handled by the same heat sink as the LED.
2. Mounted onto a 2−layer, 50 mm
2
per layer, 1 oz Cu, FR4 PCB.
3. Max operating temperature for DC conditions is 150°C, but not to exceed 175°C for pulsed conditions with low duty cycle or non−repetitive.
HBL5006 Series
http://onsemi.com
3
ELECTRICAL CHARACTERISTICS (Unless otherwise noted: T
A
= 25°C)
Symbol
Characteristics Package Min Typ Max Unit
V
BR
Breakdown Voltage: The minimum voltage across the device in or
at the breakdown region. Measured at I
BR
= 1 mA.
SOD−323 6.2 7.0
V
SOD−523 6.2 7.0
SOD−923 6.2 7.0
I
H
Holding Current: The minimum current required to maintain the
device in the on-state.
SOD−323 25 40
mA
SOD−523 25 40
SOD−923 25 40
I
L
Latching Current: The minimum current required to turn from the
off-state to the on-state.
SOD−323 9.0
mA
SOD−523 9.0
SOD−923 9.0
V
BO
Breakover Voltage: The voltage across the device in the breakover
region.
SOD−323 6.5 7.2 8.0
V
SOD−523 6.5 7.2 8.0
SOD−923 6.5 7.2 8.0
I
R
Off−State Current: The dc value of current that results from the
application of the off-state voltage. Measured at 3.3 V.
SOD−323 1.0 mA
SOD−523 1.0
SOD−923 1.0
V
T
On−State Voltage. Measured at 100 mA.
SOD−323 0.9 1.1 1.3
V
SOD−523 0.9 1.1 1.3
SOD−923 0.9 1.1 1.3
V
C
Clamping Voltage
TLP (Note 4)
IEC 6100−4−2 Level 2 equivalent
(±4 kV Contact, ±4 kV Air)
IEC 6100−4−2 Level 4 equivalent
(±8 kV Contact, ±15 kV Air)
}
}
I
PP
= 8 A
I
PP
= 16 A
SOD−323 6.5
11.2
V
SOD−523 6.5
11.2
SOD−923 6.5
11.2
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. ANSI/ESD STM5.5.1 − Electrostatic Discharge Sensitivity Testing using Transmission Line Pulse (TLP) Model TLP conditions: Z
0
= 50 W,
t
p
= 100 ns, t
r
= 4 ns, averaging window; t
1
= 30 ns to t
2
= 60 ns.
Figure 1. I−V Characteristics
Breakover
Voltage
Voltage
Current
On−state
Current
Holding Current
Latching Current
Off−state
Current
Breakdown
Voltage
P1-P3P4-P6P7-P7

SZHBL5006P2T5G

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Buy SZHBL5006P2T5G
Manufacturer:
ON Semiconductor
Description:
LED Protection Devices SHUNT HBLED PROTECTION
Lifecycle:
New from this manufacturer.
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