1-1437514-3

Product
Specification
108-1979
11Mar11 Rev B
AUGAT* HOLTITE* Sockets
1. SCOPE
1.1. Content
This specification covers performance, tests and quality requirements for the TE Connectivity (TE)
AUGAT* HOLTITE* Sockets. These sockets are designed to be press-fit into a plated through hole of a
printed circuit board. This unique design allows the plated through hole to become a component socket.
The sockets are designed to accept a .016 to .021 inch round lead (5P), .011 X .018 inch rectangular
lead (5P), .020 to .030 inch round lead (6P), .025 to .035 inch round lead (8P) and .035 to .045 inch
round lead (12P).
1.2. Qualification
When tests are performed on the subject product line, procedures specified in Figure 1 shall be used.
All inspections shall be performed using the applicable inspection plan and product drawing.
1.3. Qualification Test Results
Successful qualification testing on the subject product line has been completed. The Qualification Test
Report number for this testing is 501-500. This documentation is on file at and available from
Engineering Practices and Standards (EPS).
2. APPLICABLE DOCUMENTS
The following documents form a part of this specification to the extent specified herein. Unless
otherwise specified, the latest edition of the document applies. In the event of conflict between the
requirements of this specification and the product drawing, the product drawing shall take precedence.
In the event of conflict between the requirements of this specification and the referenced documents,
this specification shall take precedence.
2.1. TE Documents
! 109-197: TE Test Specifications vs EIA and IEC Test Methods
! 501-500: Qualification Test Report
2.2. Commercial Standard
EIA-364: Electrical Connector/Socket Test Procedures Including Environmental Classifications
3. REQUIREMENTS
3.1. Design and Construction
Product shall be of the design, construction and physical dimensions specified on the applicable product
drawing.
3.2. Materials
Materials used in the construction of this product shall be as specified on the applicable product
drawing.
©2011 Tyco Electronics Corporation,
a TE Connectivity Ltd. Company
All Rights Reserved
| Indicates change
*Trademark
For latest revision, visit our website at www.te.com/documents.
For Regional Customer Service, visit our website at www.te.com
1 of 5
TE logo is a trademark. Other products, logos, and company names might be trademarks of their respective owners. LOC B
108-1979
3.3. Ratings
! Current: 5 amperes using an .062 inch thick glass epoxy, Type FR4, with 2 ounce copper, plated,
with electroplated (.001 inch minimum) copper and electroplated tin/lead (.0003 inch minimum)
plated through holes.
! Temperature:
Gold contacts: -55 to 125°C
Tin/lead contacts: -55 to 105°C
3.4. Performance and Test Description
Product is designed to meet the electrical, mechanical and environmental performance requirements
specified in Figure 1. Unless otherwise specified, all tests shall be performed at ambient environmental
conditions per EIA-364.
3.5. Test Requirements and Procedures Summary
Test Description Requirement Procedure
Examination of product. Meets visual requirements. EIA-364-18.
Visual inspection.
ELECTRICAL
Low level contact resistance. 10 milliohms maximum initial for
recessed contacts
11 milliohms maximum initial for
flush contacts.
15 milliohms maximum final.
EIA-364-23.
Subject specimens to 100
milliamperes maximum and 20
millivolts maximum open circuit
voltage.
See Figure 3.
Insulation resistance. 1,000 megohms minimum. EIA-364-21.
Test between adjacent contacts on
.100 inch centerlines.
Temperature rise vs current. 30EC maximum temperature rise at
specified current.
EIA-364-70,
Method 1.
Stabilize at a single current level
until 3 readings at 5 minute
intervals are within 1EC.
MECHANICAL
Vibration, sinusoidal. No discontinuities of 1 microsecond
or longer duration.
See Note.
EIA-364-28,
Test Condition IV.
Subject mated specimens to 10-
2000-10 Hz traversed in 20 minutes
with 1.5 mm [.06 in] maximum total
excursion or 20 G’s, whichever is
less. 4 hours in each of 3 mutually
perpendicular planes.
Durability. See Note. EIA-364-9.
Insert and withdraw a .020 inch
diameter polished steel test pin 50
times at a maximum rate of 500
cycles per hour.
Figure 1 (continued)
Rev B 2 of 5
108-1979
Test Description Requirement Procedure
Insertion force. 330 grams maximum. EIA-364-13.
Measure the force necessary to
insert a .020 inch diameter polished
steel test pin at a maximum rate of
12.7 mm [.5 in] per minute.
Withdrawal force. 16 grams minimum. EIA-364-13.
Measure force necessary to
withdraw a .016 inch diameter
polished steel test pin at a
maximum rate of 12.7 mm [.5 in]
per minute.
Contact retention. 2,267 grams minimum. EIA-364-13.
Measure force necessary to push a
contact out of an .039 inch diameter
plated through hole.
ENVIRONMENTAL
Thermal shock. See Note. EIA-364-32, Test Condition IV.
Subject specimens to 5 cycles
between -65 and 150°C.
Humidity-temperature cycling. See Note. EIA-364-31, Method III.
Subject specimens to 10 cycles (10
days) between 25 and 65°C at 80 to
100% RH.
Salt spray. See Note. EIA-364-26, Test Condition B.
Subject specimens to a 5% salt fog
mist for 48 hours.
Temperature cycling. See Note. EIA-364-32, Test Condition VII.
Except: Subject specimens to 100
cycles between -40 and 120°C,
dwell time and transition time shall
be 30 minutes (120 minute cycle).
Shall meet visual requirements, show no physical damage, and meet requirements of additional
NOTE
tests as specified in the Product Qualification and Requalification Test Sequence shown in Figure
2.
Figure 1 (end)
Rev B 3 of 5

1-1437514-3

Mfr. #:
Manufacturer:
TE Connectivity / AMP Connectors
Description:
IC & Component Sockets 1 POS DIP THRU-HOLE
Lifecycle:
New from this manufacturer.
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