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IR2308(S) & (PbF)
Symbol Definition Min. Max. Units
V
B
High side floating absolute voltage -0.3 625
V
S
High side floating supply offset voltage V
B
- 25 V
B
+ 0.3
V
HO
High side floating output voltage V
S
- 0.3 V
B
+ 0.3
V
CC
Low side and logic fixed supply voltage -0.3 25
V
LO
Low side output voltage -0.3 V
CC
+ 0.3
V
IN
Logic input voltage (HIN & LIN ) V
SS
- 0.3 V
CC
+ 0.3
dV
S
/dt Allowable offset supply voltage transient — 50 V/ns
P
D
Package power dissipation @ T
A
≤ +25°C (8 lead PDIP) — 1.0
(8 lead SOIC) — 0.625
Rth
JA
Thermal resistance, junction to ambient (8 lead PDIP) — 125
(8 lead SOIC) — 200
T
J
Junction temperature — 150
T
S
Storage temperature -50 150
T
L
Lead temperature (soldering, 10 seconds) — 300
Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage param-
eters are absolute voltages referenced to COM. The thermal resistance and power dissipation ratings are measured
under board mounted and still air conditions.
Note 1: Logic operational for V
S
of -5 to +600V. Logic state held for V
S
of -5V to -V
BS
. (Please refer to the Design Tip
DT97-3 for more details).
V
°C
°C/W
W
Recommended Operating Conditions
The Input/Output logic timing diagram is shown in figure 1. For proper operation the device should be used within the
recommended conditions. The V
S
and V
SS
offset rating are tested with all supplies biased at 15V differential.
VB High side floating supply absolute voltage V
S
+ 10 V
S
+ 20
V
S
High side floating supply offset voltage Note 1 600
V
HO
High side floating output voltage V
S
V
B
V
CC
Low side and logic fixed supply voltage 10 20
V
LO
Low side output voltage 0 V
CC
V
IN
Logic input voltage COM V
CC
T
A
Ambient temperature -40 125
V
Symbol Definition Min. Max. Units
°C
