Tflex
TM
HD90000 Series
Thermal Gap Filler
Americas: +1.866.928.8181
Europe: +49.(0).8031.2460.0
Asia: +86.755.2714.1166
www.lairdtech.com
PRODUCT DESCRIPTION
Laird’s Tflex™ HD90000 is the latest product in our High Deflection series. Tflex™ HD90000
combines 7.5 W/mK thermal conductivity with superior pressure versus deflection
characteristics. The combination will allow minimal stress on components while also yielding
low thermal resistance. As a result, less mechanical and thermal stresses will be experienced
within your device.
Tflex™ HD90000 is available in thickness from 0.040” (1000 µm) to 0.200” (5000 µm). Laird
can provide material to meet your production needs in any region through our local
production facilities. Please contact your local Laird sales or field engineering contact for
samples or questions.
FEATURES AND BENEFITS
• 7.5 W/mK thermal conductivity
• Low pressure versus deflection
• Excellent surface wetting for low contact resistance
• Minimizes board and component stress
• Low Outgassing
• Low D3-D20 (< 20ppm)
• Large tolerance applications
• Environmentally friendly solution that meets regulatory requirements including RoHS and
REACH
SPECIFICATIONS
TYPICAL PROPERTIES VALUE TEST METHOD
Construction & Composition Ceramic filled silicone sheet N/A
Color Grey Visual
Thickness Range 0.040” (1000 µm) - 0.20” (5000 µm) N/A
Thermal Conductivity (W/mK) 7.5 Hot Disk
Density (g/cc) 3.5 Helium Pycnometer
Hardness (Shore 00) 22 ASTM D2240
Outgassing TML (weight %) 0.17 ASTM E595
Outgassing CVCM (weight %) 0.01 ASTM E595
Temperature Range -50°C to 125°C Laird Test Method
Rth at 40 mils, 10 psi, 50
0
C 0.198°C–in2/W ASTM D5470
Dielectric Constant at 1 MHz 8.14 ASTM D150
UL Flammability Rating V-0 pending UL 94
Volume Resistivity
8.73 10
13
ohm-cm
ASTM D257
