NXP Semiconductors
MC33664
Isolated network high-speed transceiver
MC33664_SDS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved.
Short data sheet: technical data Rev. 1.0 — 23 May 2018
5 / 15
8 Thermal characteristics
Table 5. Thermal characteristics
Symbol Parameter Conditions Min Max Unit
T
amb
ambient temperature −40 +125 °C
T
j
junction temperature
[1]
−40 +150 °C
T
stg
storage temperature −55 +150 °C
T
reflow(peak)
peak reflow temperature
[2]
[3]
- 260 °C
R
th(j-a)
thermal resistance from junction to ambient single layer (1s)
[4]
- 125 °C/W
R
th(j-pcb)
thermal resistance from junction to printed-circuit board multi layer (2s2p)
[5]
- 62 °C/W
[1] Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, air
flow, power dissipation of other components on the board, and board thermal resistance.
[2] Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction
or permanent damage to the device.
[3] Package reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For peak package reflow temperature and moisture sensitivity
levels (MSL), go to http://www.nxp.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts
(i.e. MC33xxxD enter 33xxx)], and review parametric.
[4] Per SEMI G38-87 and JEDEC standard JESD51-2 with the single-layer board horizontal.
[5] Indicates the maximum thermal resistance between the die and the exposed pad surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1) with the cold plate temperature used for the case temperature.
9 Characteristics
Table 6. Characteristics
Characteristic noted under conditions 4.75 V ≤ V
CC5
≤ 5.5 V, 3.1 V ≤ V
IO
≤ 5.5 V, −40 °C ≤ T
amb
≤ 125 °C, unless otherwise
noted. Typical values noted reflect the approximate parameter mean at V
CC5
= 5.0 V, V
IO
= 3.3 V/5.0 V, T
amb
= 25 °C and
device operating under nominal conditions unless otherwise noted.
Symbol Parameter Conditions Min Typ Max Unit
Power supply VCC5
fully operational 4.75 — 5.5 VV
CC5
supply voltage
limited operation 4.5 — 4.75 V
Normal mode; EN = 1;
continuous transmit;
50 Ω load
40 mAI
VCC5(NORMAL)
supply current
Normal mode; EN = 1;
continuous receive
3.0 mA
I
VCC5(SLEEP)
supply current Sleep mode; EN = 0;
INTB = 5.0 V
30 μA
VCC5
UV
VCC5 undervoltage POR
threshold
4.0 — 4.5 V
VCC5
UV_FLT
VCC5 undervoltage POR filter 2.5 μs
VCC5
UVHYS
VCC5 undervoltage POR
hysteresis
100 mV
Power supply VIO
V
IO
supply voltage 3.1 — 5.5 V
VIO
UV
VIO undervoltage POR
threshold
2.2 — 3.1 V
