TV30C131JB-G

PROTECTION PRODUCTS
1
www.semtech.com
PROTECTION PRODUCTS - MicroClamp
TM
uClamp3305P
Low Voltage TVS
for ESD Protection
Description
Features
Circuit Diagram Package
Revision 02/15/2008
The μClamp
TM
series of TVS arrays are designed to
protect sensitive electronics from damage or latch-up
due to ESD, lightning, and other voltage-induced
transient events. Each device will protect up to four
lines operating at 3.3 volts.
The μClamp
TM
3305P is a solid-state device designed
specifically for transient suppression. It is constructed
using Semtech’s proprietary EPD process technology.
The EPD process provides low standoff voltages with
significant reductions in leakage currents and capaci-
tance over traditional pn junction processes. They offer
desirable characteristics for board level protection
including fast response time, low clamping voltage and
no device degradation.
The μClamp3305P may be used to meet the immunity
requirements of IEC 61000-4-2, level 4 (±15kV air,
±8kV contact discharge). It is packaged in an ultra
small SLP1616P6 package with a low profile of only
0.58mm. The leads are spaced at a pitch of 0.5mm
and are finished with lead-free NiPdAu. The small
package makes it ideal for use in portable electronics
such as cell phones, digital still cameras, and notebook
computers.
Applications
Mechanical Characteristics
Cellular handsets and accessories
Notebooks and handhelds
MP3 Players
Digital cameras
Portable instrumentation
PDA’s
Transient protection for data lines to
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (tp = 5/50ns)
Small package for use in portable electronics
Protects five I/O lines
Working voltage: 3.3V
Low leakage current
Low operating and clamping voltages
Solid-state silicon-avalanche technology
SLP1616P6 package
RoHS/WEEE Compliant
Nominal Dimensions: 1.6 x 1.6 x 0.58 mm
Lead Pitch: 0.5mm
Lead Finish: NiPdAu
Marking : Orientation Mark and Marking Code
Packaging : Tape and Reel
6 Pin SLP package (Bottom Side View)
1.6 x 1.6 x 0.58mm (Nominal)
Device Schematic
Center Tab (GND)
1
3
4
5
6
0.6
1.6
1.6
1
0.5
6
2© 2008 Semtech Corp.
www.semtech.com
PROTECTION PRODUCTS
uClamp3305P
Absolute Maximum Rating
Electrical Characteristics (T=25
o
C)
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kp
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(tnerruCesluPkaePmumixaM)sμ02/8=ptI
pp
5spmA
)riA(2-4-00016CEIrepDSE
)tcatnoC(2-4-00016CEIrepDSE
V
PP
02-/+
51-/+
Vk
erutarepmeTgnitarepOT
J
521+ot55-C°
erutarepmeTegarotST
GTS
051+ot55-C°
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egatloVffO-dnatSesreveRV
MWR
3.3V
egatloVhguorhT-hcnuPV
TP
I
TP
Aμ2=5.39.36.4V
egatloVkcaB-panSV
BS
I
BS
Am05=8.2V
tnerruCegakaeLesreveRI
R
V
MWR
V3.3=50.05.0Aμ
egatloVgnipmalCV
C
I
PP
sμ02/8=pt,A1=
dnGotO/IynA
5.5V
egatloVgnipmalCV
C
I
PP
sμ02/8=pt,A5=
dnGotO/IynA
0.8V
egatloVgnipmalCesreveRV
RC
I
PP
sμ02/8=pt,A1=
dnGotO/IynA
4.2V
ecnaticapaCnoitcnuJC
j
dnGotnipO/I
V
R
zHM1=f,V0=
0252Fp
dnGotnipO/I
V
R
zHM1=f,V3.3=
21Fp
nipO/IotnipO/I
V
R
zHM1=f,V0=
015.21Fp
nipO/IotnipO/I
V
R
zHM1=f,V3.3=
5.7Fp
3
© 2008 Semtech Corp.
www.semtech.com
PROTECTION PRODUCTS
uClamp3305P
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
0
10
20
30
40
50
60
70
80
90
100
110
0 25 50 75 100 125 150
Ambient Temperature - T
A
(
o
C)
% of Rated Power or I
PP
Power Derating Curve
Clamping Voltage vs. Peak Pulse Current
Normalized Capacitance vs. Reverse Voltage
ESD Clamping
(8kV Contact per IEC 61000-4-2)
0.01
0.1
1
0.1 1 10 100 1000
Pulse Duration - tp (µs)
Peak Pulse Power - P
PP
(kW)
Forward Voltage vs. Forward Current
0
1
2
3
4
5
6
7
8
0123456
Forward Current - I
F
(A)
Forward Voltage - V
F
(V)
Waveform
Parameters:
tr = 8μs
td = 20μs
0
0.2
0.4
0.6
0.8
1
1.2
0 0.5 1 1.5 2 2.5 3 3.5
Reverse Voltage - V
R
(V)
C
J
(V
R
) / C
J
(V
R
=0)
f = 1 MHz
Line-Ground
Line-Line
0
2
4
6
8
10
0123456
Peak Pulse Current - I
PP
(A)
Clamping Voltage - V
C
(V)
Waveform
Parameters:
tr = 8μs
td = 20μs

TV30C131JB-G

Mfr. #:
Manufacturer:
Comchip Technology
Description:
TVS Diodes / ESD Suppressors TVS DIODE 130VWM 209VC DO214AB SMC
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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