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XC8102AA01MR-G

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P22
19/22
XC8102
Series
● USPN-4 Power Dissipation
Board Mount (Tj max = 125℃)
Ambient Temperature（℃） Power Dissipation Pd（mW） Thermal Resistance (℃/W)
25 640
166.67
85 240
■PACKAGING INFORMATION (Continued)
Power dissipation data for the USPN-4 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
1. Measurement Condition (Reference data)
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board: Dimensions 40 x 40 mm (1600 mm
2
in one side)
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
Material: Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 4 x 0.8 Diameter
Evaluation Board (Unit: mm)
2. Power Dissipation vs. Ambient Temperature
40.0
2.5
28.9
Pd-Ta特性グラフ
0
100
200
300
400
500
600
700
25 45 65 85 105 125
周囲温度Ta（℃）
許容損失Pd（mW）
Power Dissipation Pd (mW)
Pd vs Ta
Ambient Tem
erature Ta
℃
)
20/22
XC8102 Series
● USP-6B06 Power Dissipation
1.4
40.0
40.0
2.5
28.9
28.9
2.54
Board Mount (Tj max = 125℃)
Ambient Temperature（℃） Power Dissipation Pd（mW） Thermal Resistance (℃/W)
25 900
111.11
85 360
■PACKAGING INFORMATION (Continued)
Power dissipation data for the USP-6B06 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
2. Measurement Condition (Reference data)
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board: Dimensions 40 x 40 mm (1600 mm
2
in one side)
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
Material: Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 4 x 0.8 Diameter
Evaluation Board (Unit: mm)
2. Power Dissipation vs. Ambient Temperature
21/22
XC8102
Series
●SOT-25、USP-4、USP-6B06
●SSOT-24、USPN-4
MARK PRODUCT SERIES
C XC8102******
MARK PRODUCT SERIES
F XC8102A*****
MARK PRODUCT SERIES
C XC8102*A****
MARK PRODUCT SERIES
C XC8102******
MARK PRODUCT SERIES
5 XC8102AA****
■MARKING RULE
SOT-25
(TOP VIEW)
USP-4
(TOP VIEW)
① represents product series
② represents CE pin logic
③ represents C
L
Discharge Function
④⑤ represents production lot number
01, …,09, 0A, …,0Z, 11,…,9Z, A1, …, A9, AA, …, Z9, ZA,…,ZZ repeated.
(G, I, J, O, Q, W excluded)
*No character inversion used.
SSOT-24
(TOP VIEW)
USPN-4
(TOP VIEW)
① represents product series
② represents CE pin logic and C
L
Discharge Function
③④ represents production lot number
01, …,09, 0A, …,0Z, 11,…,9Z, A1, …, A9, AA, …, Z9, ZA,…,ZZ repeated.
(G, I, J, O, Q, W excluded)
*No character inversion used.
USP-6B06
(TOP VIEW)
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P22

XC8102AA01MR-G

Mfr. #:
Buy XC8102AA01MR-G
Manufacturer:
Torex Semiconductor
Description:
Power Switch ICs - Power Distribution 400mA SmallLoad Switch w/CLDischarge
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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