RT9711A/B/C/D
4
DS9711A/B/C/D-03 April 2011www.richtek.com
Parameter Symbol Test Conditions Min Typ Max Units
Sho rt Circuit
Fold-Back Current
RT9711A/B
I
SC_FB
V
OUT
= 0V, measured prior to
thermal shutdown
-- 1 --
A
RT9711C/D -- 0.8 --
FLAG Out put Resistance
R
FLG
I
SINK
= 1mA
-- 20 400
Ω
FLAG Off Current
I
FLG_OF F
V
FLG
= 5V
-- 0.01 1 μA
FLAG Delay Time (Note 5)
t
D
From fault condition to FLG
assertion
5 12 20 ms
Shutdown Pull-Low Resistance
R
DS
V
EN
= 0V, V
EN
= 5V
-- 75 150
Ω
Under-voltage Lockout
V
UVLO
V
IN
increasing
1.3 1.7 -- V
Under-voltage Hysteresis
ΔV
UVLO
V
IN
decreasing
-- 0.1 -- V
Thermal Shutdown Protection
T
SD
-- 130 --
°C
Thermal Shutdown Hysteresis
ΔT
SD
-- 20 --
°C
Note 1. Stresses listed as the above "Absolute Maximum Ratings" may cause permanent damage to the device. These are for
stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended
periods may remain possibility to affect device reliability.
Note 2. θ
JA
is measured in the natural convection at T
A
= 25°C on a low effective thermal conductivity single layer test board of
JEDEC 51-3 thermal measurement standard.
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
Note 5. The FLAG delay time is input voltage dependent, see“ Typical Operating Characteristics” graph for further details.
