(0.50 mm) .0197"
BSH SERIES
BSH–060–01–F–D–RA–WT
BSH–090–01–L–D–A
BSH–060–01–F–D–A
BSH–030–01–L–D–RA–WT
WWW.SAMTEC.COM
Due to technical progress, all designs, specifications and components are subject to change without notice.
For complete specifications and
recommended PCB layouts see
www.samtec.com?BSH
Insulator Material: Black LCP
Contact Material:
Phosphor Bronze
Plating: Au or Sn over
50 µ" (1.27 µm) Ni
Current Rating: 2 A per pin
(1 pin powered per row)
Flammability Rating: UL 94 VO
Operating Temp Range:
-55 °C to +125 °C
Voltage Rating: 275 VAC
Max Cycles: 100
RoHS Compliant: Ye s
Note: Some lengths, styles
and options are non-standard,
non-returnable.
SPECIFICATIONS
Mates with:
BTH
Mates with:
BTH
BSH
NO. OF POSITIONS
PER ROW
NO. OF POSITIONS
PER ROW
D
D WT
PLATING
OPTION
PLATING
OPTION
–030, –050, –060,
–090, –120, –150
–030, –060, –090
OTHER
OPTION
OTHER
OPTION
A
RA
–TR
= Tape & Reel
(120 positions
maximum)
–GP
= Guide Post
01
01BSH
No. of Positions x (0.50) .01969
+ (6.27) .247
(6.22)
.245
(3.81)
.150
(7.24)
.285
(0.89)
.035
DIA
(0.15)
.006
(3.05)
.120
(0.76)
.030
(3.25)
.128
02
01
(0.50)
.01969
–F
= Gold Flash on contact, Matte Tin on tail
–L
= 10 µ" (0.25 µm) Gold on contact,
Matte Tin on tail
–C*
= Electro-Polished Selective
50 µ" (1.27 µm) min Au over 150 µ" (3.81 µm)
Ni on Signal Pins in contact area,
Matte Tin over 50 µ" (1.27 µm) min
Ni on all solder tails
–F
= Gold Flash on contact, Matte Tin on tail
–L
= 10 µ" (0.25 µm) Gold on contact, Matte Tin on tail
Specify: ASP-65067-01
F-217
BASIC BLADE & BEAM SOCKET
No. of Positions x (0.50) .01969 + (10.88) .428
(13.59)
.535
(7.24)
.285
(8.82)
.347
(0.64)
.025
SQ
(1.32)
.052
DIA
x
(1.32) (1.10)
.052 .043
01
02
(0.15)
.006
(0.50)
.01969
For complete scope
of recognitions see
www.samtec.com/quality
RECOGNITIONS
*Note: –C Plating passes 10 year MFG testing
ALSO AVAILABLE
(MOQ Required)
MATED HEIGHT
• 30 µ" (0.76 µm) Gold
• Edge Mount Capability
• 8 mm, 11 mm, 16 mm,
19 mm and 22 mm Stack
Height (Caution: Some
automatic placement/
inspection machines may have
component height restrictions.
Please consult machinery
specifications.) (11 mm, 16
mm, 19 mm and 22 mm not
available with 50 positions)
Contact Samtec.
LEAD
STYLE
MATED
HEIGHT*
–01
(5.00) .197
*Processing conditions will
affect mated height.
AGILENT LOGIC ANALYZER
TEST POINT CONNECTOR
PROCESSING
Lead-Free Solderable: Ye s
SMT Lead Coplanarity:
(0.10 mm) .004" max (030-090)
(0.15 mm) .006" max (120-150)
Board Stacking:
For applications requiring more
than two connectors per board
or 90 positions or higher,
contact ipg@samtec.com
EXTENDED LIFE
PRODUCT
10 YEAR MFG
WITH 50 µ" GOLD
HIGH MATING
CYCLES
