Operating Current (OUT to GND) ......................................20mA
Forward Current (GND to OUT) .........................................20mA
Continuous Power Dissipation (Multilayer Board;
derate 9.75mW/°C above +70°C) ................................ 780mW
Operating Temperature Range ......................... -40°C to +125°C
Storage Temperature Range ............................ -65°C to +150°C
Junction Temperature ...................................................... +150°C
Soldering Temperature (reflow) ....................................... +260°C
(T
A
=-40°C to +125°C, unless otherwise noted., Typical values are at T
A
= +25°C. (Note 1))
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
MAX6069A (1.250V)
Reverse Breakdown Voltage V
R
T
A
= +25°C,
I
R
= 1.2µA
MAX6069AA (0.2%) 1.2475 1.2500 1.2525
V
MAX6069AB (0.5%) 1.2438 1.2500 1.2563
Minimum Operating Current I
RMIN
V
R
change < 0.2% from V
R
at I
R
= 1.2μA 0.5 1.0 µA
Reverse Breakdown Change
with Current
I
R
= 1.2μA to 200μA 1
mV
I
R
= 200μA to 2mA 2.0
Reverse Dynamic
Impedance
I
R
= 1.2μA to 2mA (Note 2) 1.5 Ω
Low-Frequency Noise I
R
= 1.2μA, f = 0.1Hz to 10Hz 30 µVp-p
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
WLP
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board.
For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”,
“#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
Package Information
Electrical Characteristics
Package Code W40D1+1
Outline Number 21-100139
Land Pattern Number
Refer to Application Note 1891
Thermal Resistance, Four-Layer Board:
Junction-to-Ambient (θ
JA
) 102.59°C/W
Junction-to-Case (θ
JC
) N/A
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2
MAX6069 1μA Ultra-Tiny Shunt Voltage Reference
