MC100EL56
www.onsemi.com
6
PACKAGE DIMENSIONS
SOIC−20 WB
CASE 751D−05
ISSUE H
20
1
11
10
b20X
H
c
L
18X
A1
A
SEATING
PLANE
q
h X 45
_
E
D
M
0.25
M
B
M
0.25
S
A
S
B
T
e
T
B
A
DIM MIN MAX
MILLIMETERS
A 2.35 2.65
A1 0.10 0.25
b 0.35 0.49
c 0.23 0.32
D 12.65 12.95
E 7.40 7.60
e 1.27 BSC
H 10.05 10.55
h 0.25 0.75
L 0.50 0.90
q 0 7
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF B
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
__
11.00
20X
0.52
20X
1.30
1.27
DIMENSIONS: MILLIMETERS
1
PITCH
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D
.
SOLDERING FOOTPRINT*
RECOMMENDED
10
20 11
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