X00619 Characteristics
Doc ID 15755 Rev 2 3/10
Table 5. Thermal resistances
Symbol Parameter Value Unit
R
th(j-l)
Junction to leads (DC) TO-92
Max.
70
°C/W
R
th(j-c)
Junction to case (DC) SOT-223 30
R
th(j-a)
Junction to ambient (DC)
TO-92 150
S = 5 cm
2
SOT-223 60
Figure 1. Maximum average power
dissipation versus average
on-state current
Figure 2. Average and DC on-state current
versus case temperature (SOT-223)
P(W)
0.0
0.2
0.4
0.6
0.0 0.1 0.2 0.3 0.4 0.5 0.6
°°° °
°DC
I (A)
T(AV)
360°
α
α = 30°, 60°, 90°, 120°, 180°, DC
I (A)
T(AV)
0.0
0.2
0.4
0.6
0.8
1.0
0 25 50 75 100 125
SOT-223
T (°C)
l
α = 30°, 60°, 90°, 120°, 180°, DC
Figure 3. Average and DC on-state current
versus lead temperature (TO-92)
Figure 4. Average and DC on-state current
versus ambient temperature (free
air convection)
I (A)
T(AV)
0.0
0.2
0.4
0.6
0.8
1.0
0 25 50 75 100 125
TO-92
T (°C)
l
α = 30°, 60°, 90°, 120°, 180°, DC
I (A)
T(AV)
0.0
0.2
0.4
0.6
0.8
1.0
0 25 50 75 100 125
TO-92
S
CU
= 0.5 cm²
T (°C)
amb
α = 180°
DC
SOT-223
S
CU
= 5 cm²