RTO 50
www.vishay.com
Vishay Sfernice
Revision: 31-Mar-10
1
Document Number: 50035
For technical questions, contact: sfer@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
50 W Power Resistor, Thick Film Technology, TO-220
FEATURES
• 50 W at 25 °C heatsink mounted
• Adjusted by sand trimming
• Leaded or surface mount versions
• High power to size ratio
• Non inductive element
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
Because of the knowledge and experience in Thick Film technology, Vishay Sfernice has been able to develop a high power
resistor in a TO-220 package called RTO 50. The special design of this component allows the dissipation of 50 W when mounted
on a heatsink. The ohmic value is adjusted by sand trimming. This process does not generate hot spots as in laser trimming,
which could lead to microcracks on each side of the curve. This process improves the reliability and the stability of the resistor
and at the same time gives a good overload capability.
Note
(1)
E24 series
Note
• Not compatible with RoHS reflow profile
DIMENSIONS in millimeters
STANDARD ELECTRICAL SPECIFICATIONS
MODEL SIZE
RESISTANCE
RANGE
RATED POWER
P
25 °C
W
LIMITING ELEMENT
VOLTAGE U
L
V
TOLERANCE
± %
TEMPERATURE
COEFFICIENT
± ppm/°C
CRITICAL
RESISTANCE
RTO 50 TO-220 0.010 to 550K
(1)
50 300 1, 2, 5, 10 150 1.8K
4.5
1.3
8.8
Ø 0.8
10.1
13.7
12.5
5.08
15
Ø 3.6
2.5
RTO 50F - LEADED
4.5
1.3
8.8
10.1
12.5
5.08
15
Ø 3.6
0.3
1.6
3
2
RTO 50C - FOR SURFACE MOUNTING
• Only for RTO 50 version C = during surface mount soldering, the
soldering temperature profile must not cause the metal tab of this
device to exceed 220 °C.
MECHANICAL SPECIFICATIONS
Mechanical Protection Molded
Resistive Element Thick film
Connections Tinned copper alloy
Weight 2.2 g max.
ENVIRONMENTAL SPECIFICATIONS
Temperature Range - 55 °C to 155 °C
Climatic Category 55/155/156
Sealing Sealed container, solder immersion
Flammability
IEC 60695-11-5,
2 applications 30 s seperated by 60 s
TECHNICAL SPECIFICATIONS
Dissipation and Associated Onto a heatsink
Thermal Resistance
and Nominal Power
50 W at + 25 °C
R
TH (j - c)
: 2.6 °C/W
Free air: 2.25 W at + 25 °C
Dielectric Strength
MIL STD 202 (301)
2000 V
RMS
- 1 min
10 mA max.
Insulation Resistance 10
6
M
Inductance 0.1 μH
DIMENSIONS
Standard Package TO-220 insulated case
