NTMFS5C410NLTWFT1G

© Semiconductor Components Industries, LLC, 2016
May, 2016 − Rev. 2
1 Publication Order Number:
NVMFS5C410NL/D
NTMFS5C410NLT
Power MOSFET
40 V, 0.82 mW, 330 A, Single N−Channel
Features
Small Footprint (5x6 mm) for Compact Design
Low R
DS(on)
to Minimize Conduction Losses
Low Q
G
and Capacitance to Minimize Driver Losses
NTMFS5C410NLTWF − Wettable Flank Option for Enhanced
Optical Inspection
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS (T
J
= 25°C unless otherwise noted)
Parameter
Symbol Value Unit
Drain−to−Source Voltage V
DSS
40 V
Gate−to−Source Voltage V
GS
±20 V
Continuous Drain
Current R
q
JC
(Notes 1, 3)
Steady
State
T
C
= 25°C
I
D
330
A
T
C
= 100°C 230
Power Dissipation
R
q
JC
(Note 1)
T
C
= 25°C
P
D
167
W
T
C
= 100°C 83
Continuous Drain
Current R
q
JA
(Notes 1, 2, 3)
Steady
State
T
A
= 25°C
I
D
50
A
T
A
= 100°C 35
Power Dissipation
R
q
JA
(Notes 1 & 2)
T
A
= 25°C
P
D
3.8
W
T
A
= 100°C 1.9
Pulsed Drain Current
T
A
= 25°C, t
p
= 10 ms
I
DM
900 A
Operating Junction and Storage Temperature T
J
, T
stg
55 to
+175
°C
Source Current (Body Diode) I
S
169 A
Single Pulse Drain−to−Source Avalanche
Energy (I
L(pk)
= 29 A)
E
AS
706 mJ
Lead Temperature for Soldering Purposes
(1/8 from case for 10 s)
T
L
260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter Symbol Value Unit
Junction−to−Case − Steady State
R
q
JC
0.9
°C/W
Junction−to−Ambient − Steady State (Note 2)
R
q
JA
39
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2. Surface−mounted on FR4 board using a 650 mm
2
, 2 oz. Cu pad.
3. Maximum current for pulses as long as 1 second is higher but is dependent
on pulse duration and duty cycle.
MARKING
DIAGRAM
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XXXXXX
AYWZZ
V
(BR)DSS
R
DS(ON)
MAX I
D
MAX
40 V
0.82 mW @ 10 V
330 A
1.2 mW @ 4.5 V
G (4)
S (1,2,3)
N−CHANNEL MOSFET
D (5,6)
S
S
S
G
D
D
D
D
DFN5
(SO−8FL)
CASE 488AA
STYLE 1
1
See detailed ordering, marking and shipping information on
page 5 of this data sheet.
ORDERING INFORMATION
XXXXXX = 5C410L
XXXXXX = (NTMFS5C410NLT) or
XXXXXX = 410LWF
XXXXXX = (NTMFS5C410NLTWF)
A = Assembly Location
Y = Year
W = Work Week
ZZ = Lot Traceability
NTMFS5C410NLT
www.onsemi.com
2
ELECTRICAL CHARACTERISTICS (T
J
= 25°C unless otherwise specified)
Parameter
Symbol Test Condition Min Typ Max Unit
OFF CHARACTERISTICS
Drain−to−Source Breakdown Voltage
V
(BR)DSS
V
GS
= 0 V, I
D
= 250 mA
40 V
Drain−to−Source Breakdown Voltage
Temperature Coefficient
V
(BR)DSS
/
T
J
21.2
mV/°C
Zero Gate Voltage Drain Current I
DSS
V
GS
= 0 V,
V
DS
= 40 V
T
J
= 25 °C 10
mA
T
J
= 125°C 250
Gate−to−Source Leakage Current I
GSS
V
DS
= 0 V, V
GS
= 20 V 100 nA
ON CHARACTERISTICS (Note 4)
Gate Threshold Voltage
V
GS(TH)
V
GS
= V
DS
, I
D
= 250 mA
1.2 2.0 V
Threshold Temperature Coefficient V
GS(TH)
/T
J
−5.75 mV/°C
Drain−to−Source On Resistance R
DS(on)
V
GS
= 10 V I
D
= 50 A 0.65 0.82
mW
V
GS
= 4.5 V I
D
= 50 A 0.95 1.2
Forward Transconductance g
FS
V
DS
= 15 V, I
D
= 50 A 190 S
CHARGES, CAPACITANCES & GATE RESISTANCE
Input Capacitance
C
ISS
V
GS
= 0 V, f = 1 MHz, V
DS
= 25 V
8862
pF
Output Capacitance C
OSS
4156
Reverse Transfer Capacitance C
RSS
116
Total Gate Charge Q
G(TOT)
V
GS
= 4.5 V, V
DS
= 20 V; I
D
= 50 A 66
nC
Total Gate Charge Q
G(TOT)
V
GS
= 10 V, V
DS
= 20 V; I
D
= 50 A 143
Threshold Gate Charge Q
G(TH)
V
GS
= 4.5 V, V
DS
= 20 V; I
D
= 50 A
6.75
Gate−to−Source Charge Q
GS
21.4
Gate−to−Drain Charge Q
GD
22
Plateau Voltage V
GP
2.7 V
SWITCHING CHARACTERISTICS (Note 5)
Turn−On Delay Time
t
d(ON)
V
GS
= 4.5 V, V
DS
= 20 V,
I
D
= 50 A, R
G
= 1.0 W
20
ns
Rise Time t
r
130
Turn−Off Delay Time t
d(OFF)
66
Fall Time t
f
177
DRAIN−SOURCE DIODE CHARACTERISTICS
Forward Diode Voltage
V
SD
V
GS
= 0 V,
I
S
= 50 A
T
J
= 25°C 0.73 1.2
V
T
J
= 125°C 0.6
Reverse Recovery Time t
RR
V
GS
= 0 V, dIS/dt = 100 A/ms,
I
S
= 50 A
79.5
ns
Charge Time t
a
39
Discharge Time t
b
40.5
Reverse Recovery Charge Q
RR
126 nC
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. Pulse Test: pulse width v 300 ms, duty cycle v 2%.
5. Switching characteristics are independent of operating junction temperatures.
NTMFS5C410NLT
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3
TYPICAL CHARACTERISTICS
Figure 1. On−Region Characteristics Figure 2. Transfer Characteristics
V
DS
, DRAIN−TO−SOURCE VOLTAGE (V) V
GS
, GATE−TO−SOURCE VOLTAGE (V)
3.01.51.00.50
0
20
40
60
80
100
120
140
4.02.52.01.51.00.50
0
20
40
60
80
100
140
180
Figure 3. On−Resistance vs. Gate−to−Source
Voltage
Figure 4. On−Resistance vs. Drain Current and
Gate Voltage
V
GS
, GATE VOLTAGE (V) I
D
, DRAIN CURRENT (A)
109876543
0.0006
0.0008
0.0012
50 6040302010
0.0004
0.0006
0.0008
0.0012
Figure 5. On−Resistance Variation with
Temperature
Figure 6. Drain−to−Source Leakage Current
vs. Voltage
T
J
, JUNCTION TEMPERATURE (°C) V
DS
, DRAIN−TO−SOURCE VOLTAGE (V)
15012510075250−25−50
0.9
1.1
1.3
1.5
1.7
1.9
40353025155
10
10k
I
D
, DRAIN CURRENT (A)
I
D
, DRAIN CURRENT (A)
R
DS(on)
, DRAIN−TO−SOURCE RESISTANCE (W)
R
DS(on)
, DRAIN−TO−SOURCE RESISTANCE (W)
R
DS(on)
, NORMALIZED DRAIN−TO
SOURCE RESISTANCE (W)
I
DSS
, LEAKAGE (nA)
2.8 V
3.0 V
10 V to 3.2 V
T
J
= 125°C
T
J
= 25°C
T
J
= −55°C
T
J
= 25°C
I
D
= 50 A
T
J
= 25°C
V
GS
= 4.5 V
V
GS
= 10 V
V
GS
= 10 V
I
D
= 40 A
50 175
T
J
= 125°C
T
J
= 85°C
160
180
200
120
160
2.0 2.5
0.0010
0.0007
0.0009
0.0013
0.0011
0.0005
0.0007
0.0009
0.7
100
1k
100k
1M
10 20
T
J
= 150°C
3.0 3.5
0.0010
0.0011

NTMFS5C410NLTWFT1G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
MOSFET NFET SO8FL 40V 312A
Lifecycle:
New from this manufacturer.
Delivery:
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