LTC3890-2
31
38902f
APPLICATIONS INFORMATION
PC Board Layout Checklist
When laying out the printed circuit board, the following
checklist should be used to ensure proper operation of
the IC. These items are also illustrated graphically in the
layout diagram of Figure 11. Figure 12 illustrates the current
waveforms present in the various branches of the 2-phase
synchronous regulators operating in the continuous mode.
Check the following in your layout:
1. Are the top N-channel MOSFETs MTOP1 and MTOP2
located within 1cm of each other with a common drain
connection at C
IN
? Do not attempt to split the input
decoupling for the two channels as it can cause a large
resonant loop.
2. Are the signal and power grounds kept separate? The
combined IC signal ground pin and the ground return
of C
INTVCC
must return to the combined C
OUT
(–) ter-
minals. The path formed by the top N-channel MOSFET,
Schottky diode and the C
IN
capacitor should have short
leads and PC trace lengths. The output capacitor (–)
terminals should be connected as close as possible
to the (–) terminals of the input capacitor by placing
the capacitors next to each other and away from the
Schottky loop described above.
3. Do the LTC3890-2 V
FB
pins’ resistive dividers connect
to the (+) terminals of C
OUT
? The resistive divider
must be connected between the (+) terminal of C
OUT
and signal ground. The feedback resistor connections
should not be along the high current input feeds from
the input capacitor(s).
4. Are the SENSE
and SENSE
+
leads routed together with
minimum PC trace spacing? The filter capacitor between
SENSE
+
and SENSE
should be as close as possible
to the IC. Ensure accurate current sensing with Kelvin
connections at the SENSE resistor.
5. Is the INTV
CC
decoupling capacitor connected close
to the IC, between the INTV
CC
and the power ground
pins? This capacitor carries the MOSFET drivers’ cur-
rent peaks. An additional 1µF ceramic capacitor placed
immediately next to the INTV
CC
and PGND pins can help
improve noise performance substantially.
6. Keep the switching nodes (SW1, SW2), top gate nodes
(TG1, TG2), and boost nodes (BOOST1, BOOST2) away
from sensitive small-signal nodes, especially from
the opposites channel’s voltage and current sensing
feedback pins. All of these nodes have very large and
fast moving signals and therefore should be kept on
the output side of the LTC3890-2 and occupy minimum
PC trace area.
7. Use a modified star ground technique: a low impedance,
large copper area central grounding point on the same
side of the PC board as the input and output capacitors
with tie-ins for the bottom of the INTV
CC
decoupling
capacitor, the bottom of the voltage feedback resistive
divider and the SGND pin of the IC.
LTC3890-2
32
38902f
PC Board Layout Debugging
Start with one controller on at a time. It is helpful to use
a DC-50MHz current probe to monitor the current in the
inductor while testing the circuit. Monitor the output switch-
ing node (SW pin) to synchronize the oscilloscope to the
internal oscillator and probe the actual output voltage as
well. Check for proper performance over the operating
voltage and current range expected in the application.
The frequency of operation should be maintained over the
input voltage range down to dropout and until the output
load drops below the low current operation threshold—
typically 15% of the maximum designed current level in
Burst Mode operation.
The duty cycle percentage should be maintained from cycle
to cycle in a well-designed, low noise PCB implementa-
tion. Variation in the duty cycle at a subharmonic rate can
suggest noise pickup at the current or voltage sensing
inputs or inadequate loop compensation. Overcompen-
sation of the loop can be used to tame a poor PC layout
if regulator bandwidth optimization is not required. Only
after each controller is checked for its individual perfor-
mance should both controllers be turned on at the same
time. A particularly difficult region of operation is when
one controller channel is nearing its current comparator
trip point when the other channel is turning on its top
MOSFET. This occurs around 50% duty cycle on either
channel due to the phasing of the internal clocks and may
cause minor duty cycle jitter.
Reduce V
IN
from its nominal level to verify operation of
the regulator in dropout. Check the operation of the un-
dervoltage lockout circuit by further lowering V
IN
while
monitoring the outputs to verify operation.
Investigate whether any problems exist only at higher out-
put currents or only at higher input voltages. If problems
coincide with high input voltages and low output currents,
look for capacitive coupling between the BOOST, SW, TG,
and possibly BG connections and the sensitive voltage
and current pins. The capacitor placed across the current
sensing pins needs to be placed immediately adjacent to
the pins of the IC. This capacitor helps to minimize the
effects of differential noise injection due to high frequency
capacitive coupling. If problems are encountered with
high current output loading at lower input voltages, look
for inductive coupling between C
IN
, Schottky and the top
MOSFET components to the sensitive current and voltage
sensing traces. In addition, investigate common ground
path voltage pickup between these components and the
SGND pin of the IC.
An embarrassing problem, which can be missed in an
otherwise properly working switching regulator, results
when the current sensing leads are hooked up backwards.
The output voltage under this improper hookup will still
be maintained but the advantages of current mode control
will not be realized. Compensation of the voltage loop will
be much more sensitive to component selection. This
behavior can be investigated by temporarily shorting out
the current sensing resistor—don’t worry, the regulator
will still maintain control of the output voltage.
APPLICATIONS INFORMATION
LTC3890-2
33
38902f
Efficiency and Power Loss
vs Output Current
Efficiency vs Load Current Efficiency vs Input Voltage
TYPICAL APPLICATIONS
Figure 13. High Efficiency Dual 8.5V/3.3V Step-Down Converter
MTOP2
SENSE1
+
SENSE1
V
FB1
TRACK/SS2
ITH2
V
FB2
SENSE2
SENSE2
+
ITH1
TRACK/SS1
I
LIM
PHASMD
CLKOUT
PLLIN/MODE
SGND
EXTV
CC
RUN1
RUN2
FREQ
PGOOD2
BG1
C
ITH1A
100pF
C
ITH1
1000pF
C
SS2
0.01µF
C
SS1
0.01µF
C
ITH2
470pF
C1
1nF
C
OUT1
470µF
R
A1
31.6k
R
ITH1
34.8k
R
B1
100k
R
B2
100k
R
FREQ
41.2k
R
ITH2
34.8k
MTOP1, MTOP2, MBOT1, MBOT2: RJK0651DPB
L1: COILCRAFT SER1360-472KL
L2: COILCRAFT SER1360-802KL
C
OUT1
: SANYO 6TPE470M
C
OUT2
: SANYO 10TPE330M
D1, D2: DFLS1100
D1
D2
LTC3890-2
R
SENSE1
8m
R
SENSE2
10m
L1
4.7µH
L2
8µH
MBOT1
TG1
MTOP1
V
OUT1
3.3V
5A
2.2µF
×3
V
IN
9V TO 60V
38902 TA02a
100k
PGOOD1
INTV
CC
100k
C
B1
0.1µF
R
A2
10.5k
SW1
V
OUT2
8.5V
3A
SW2
BOOST1
C
B2
0.1µF
BOOST2
V
IN
INTV
CC
PGND
TG2
BG2
C
OUT2
330µF
C
INT
4.7µF
C
IN
100µF
MBOT2
C2
1nF
V
OUT2
+
OUTPUT CURRENT (A)
0
EEFICIENCY (%)
POWER LOSS (mW)
70
100
10.10.010.0010.0001 10
38902 TA02b
50
40
30
20 1
10
100
1000
10000
0.1
10
60
80
90
V
IN
= 12V
V
OUT
= 3.3V
BURST EFFICIENCY
FCM LOSS
PULSE-SKIPPING
LOSS
BURST LOSS
FCM EFFICIENCY
PULSE-SKIPPING
EFFICIENCY
OUTPUT CURRENT (A)
0
EEFICIENCY (%)
70
100
10.10.010.0010.0001 10
38902 TA02c
50
40
30
20
10
60
80
90
V
OUT
= 8.5V
V
OUT
= 3.3V
V
IN
= 12V
INPUT VOLTAGE (V)
80
EEFICIENCY (%)
94
100
20 30 35 40 45 50 55 6015105025
38902 TA02d
90
88
86
84
82
92
96
98
V
OUT1
= 3.3V
V
OUT2
= 8.5V
I
LOAD
= 2A

LTC3890HUH-2#PBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
Switching Voltage Regulators 60V Low IQ, Dual Output Synchronous Step-Down Controller
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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