ISL23710WIU10Z

7
FN6126.0
August 22, 2005
one of one-hundred twenty-eight wiper positions along the
resistive array.
Bringing CS
HIGH after INC is HIGH will cause the wiper
value to be locked until power down (further changes in CS
and INC will not change the wiper position). Otherwise, INC
should be brought HIGH after CS
to allow continued wiper
changes.
The state of U/D
may be changed while CS remains LOW.
This allows the host system to enable the device and then
move the wiper up and down until the proper trim is attained.
During initial power-up CS
must go high along with or before
V
CC
to avoid an accidental tap position change.
TABLE 1. MODE SELECTION
CS INC U/D MODE
L H Wiper Up
L L Wiper Down
H X Lock Wiper Value
H X Standby
L X Standby
H H X Standby
L H Wiper up One Position
(not recommended)
L L Wiper Down One Position
(not recommended)
ISL23710
8
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Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN6126.0
August 22, 2005
ISL23710
Mini Small Outline Plastic Packages (MSOP)
NOTES:
1. These package dimensions are within allowable dimensions of
JEDEC MO-187BA.
2. Dimensioning and tolerancing per ANSI Y14.5M-1994.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs and are measured at Datum Plane. Mold flash, protrusion
and gate burrs shall not exceed 0.15mm (0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions
and are measured at Datum Plane. Interlead flash and
protrusions shall not exceed 0.15mm (0.006 inch) per side.
5. Formed leads shall be planar with respect to one another within
0.10mm (.004) at seating Plane.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm (0.003 inch) total in excess
of “b” dimension at maximum material condition. Minimum space
between protrusion and adjacent lead is 0.07mm (0.0027 inch).
10. Datums and to be determined at Datum plane
.
11. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are for reference only
L
0.25
(0.010)
L1
R1
R
4X
4X
GAUGE
PLANE
SEATING
PLANE
EE1
N
12
TOP VIEW
INDEX
AREA
-C-
-B-
0.20 (0.008) A
B
C
SEATING
PLANE
0.20 (0.008) C
0.10 (0.004) C
-A-
-H-
SIDE VIEW
b
e
D
A
A1
A2
-B-
END VIEW
0.20 (0.008) C
D
E
1
C
L
C
a
- H -
- B -
- H -
M10.118 (JEDEC MO-187BA)
10 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A 0.037 0.043 0.94 1.10 -
A1 0.002 0.006 0.05 0.15 -
A2 0.030 0.037 0.75 0.95 -
b 0.007 0.011 0.18 0.27 9
c 0.004 0.008 0.09 0.20 -
D 0.116 0.120 2.95 3.05 3
E1 0.116 0.120 2.95 3.05 4
e 0.020 BSC 0.50 BSC -
E 0.187 0.199 4.75 5.05 -
L 0.016 0.028 0.40 0.70 6
L1 0.037 REF 0.95 REF -
N10 107
R 0.003 - 0.07 - -
R1 0.003 - 0.07 - -
5
o
15
o
5
o
15
o
-
0
o
6
o
0
o
6
o
-
Rev. 0 12/02

ISL23710WIU10Z

Mfr. #:
Manufacturer:
Renesas / Intersil
Description:
Digital Potentiometer ICs ISL23710W IND 10LD
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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