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ADL5725ACPZN-R7

P1-P3P4-P6P7-P9P10-P12P13-P13
Data Sheet ADL5725
Rev. 0 | Page 3 of 12
SPECIFICATIONS
AC SPECIFICATIONS
VCC1 = 1.8 V, VCC2 = 3.3 V, RBIAS = 357 Ω, T = 25°C, Z
SOURCE
= 50 Ω, Z
LOAD
= 100 Ω differential, unless otherwise noted.
Table 1.
Parameter Test Conditions/Comments Min Typ Max Unit
FREQUENCY RANGE 17.7 19.7 GHz
FREQUENCY = 17.7 GHz
Gain (S21) 27.8 dB
Noise Figure 2.4 dB
Input Third-Order Intercept (IIP3) Δf = 1 MHz, input power (P
IN
) = −30 dBm per tone −1.5 dBm
Input 1 dB Compression Point (P1dB) −14 dBm
Input Return Loss (S11) 7 dB
Output Return Loss (S22) 8 dB
FREQUENCY = 19.7 GHz
Gain (S21) 25.1 dB
Noise Figure 2.4 dB
Input Third-Order Intercept (IIP3) Δf = 1 MHz, P
IN
= −30 dBm per tone 2.0 dBm
Input 1 dB Compression Point (P1dB) −11.5 dBm
Input Return Loss (S11)
10
dB
Output Return Loss (S22) 10 dB
DC SPECIFICATIONS
Table 2.
Parameter Test Conditions/Comments Min Typ Max Unit
POWER INTERFACE
Voltage
VCC1 1.65 1.8 1.95 V
VCC2 3.1 3.3 3.5 V
Quiescent Current vs. Temperature
VCC1 T
A
= 25°C 18 mA
A
19
mA
VCC2 T
A
= 25°C 88 mA
−40°C ≤ T
A
≤ +85°C 89 mA
ADL5725 Data Sheet
Rev. 0 | Page 4 of 12
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter Rating
Supply Voltages
VCC1 2.25 V
VCC2 4.1 V
Maximum Junction Temperature 150°C
Operating Temperature Range −40°C to +85°C
Storage Temperature Range −55°C to +125°C
Lead Temperature Range (Soldering, 60 sec) −65°C to +150°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
θ
JA
is thermal resistance, junction to ambient (°C/W), θ
JB
is
thermal resistance, junction to board (°C/W), and θ
JC
is thermal
resistance, junction to case (°C/W).
Table 4. Thermal Resistance
Package Type
θ
JA
1
θ
JB
1
θ
JC
1
Unit
8-Lead LFCSP 39.90 23.88 3.71 °C/W
1
See JEDEC standard JESD51-2 for additional information on optimizing the
thermal impedance for a printed circuit board (PCB) with 3 × 4 vias.
ESD CAUTION
Data Sheet ADL5725
Rev. 0 | Page 5 of 12
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
GND
INPT
RBIAS
VCC1
OUTN
OUTP
DNC
VCC2
3
4
1
2
6
5
8
7
ADL5725
TO
P VIEW
(Not to Scale)
14318-002
NOTES
1. DNC = DO NOT CONNECT. DO NOT
CONNECT T
O THIS PIN.
2. THE EXPOSED PAD MUST BE
SOLDERED TO A LOW IMPEDANCE
GROUND PLANE.
3. THE DEVICE NUMBER ON THE FIGURE
DOES NOT INDICATE THE LABEL ON
THE
P
ACKAGE. REFER TO THE PIN 1
INDICA
T
OR FOR THE PIN LOCATIONS.
Figure 2. Pin Configuration
Table 5. Pin Function Descriptions
Pin No. Mnemonic Description
1 VCC1 1.8 V Power Supply. It is recommended to place the decoupling capacitors as close to this pin as possible.
2 GND Ground.
3 INPT RF Input. This is a 50 Ω single-ended input.
4 RBIAS Resistor Bias. For typical operation, connect a 357 Ω resistor from RBIAS to GND. It is recommended to place
the RBIAS resistor as close to the pin as possible.
5
DNC
Do Not Connect. Do not connect to this pin.
6, 7 OUTP, OUTN RF Outputs. These pins are 100 Ω differential outputs.
8 VCC2 3.3 V Power Supply. It is recommended to place the decoupling capacitors as close to this pin as possible.
EPAD (EP) Exposed Pad. The exposed pad must be soldered to a low impedance ground plane.
P1-P3P4-P6P7-P9P10-P12P13-P13

ADL5725ACPZN-R7

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Manufacturer:
Analog Devices Inc.
Description:
RF Amplifier Microwave HIR
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