Approval sheet
Page 4 of 7 ASC_RFLPF2012090K0T_V07 Jan.2012
RELIABILITY TEST
Test item
Test condition / Test method
Specification
Solderability
JIS C 0050-4.6
JESD22-B102D
*Solder bath temperature：235 ± 5°C
*Immersion time：2 ± 0.5 sec
*Solder：Sn3Ag0.5Cu for lead-free
At least 95% of a surface of each terminal
electrode must be covered by fresh solder.
Leaching
(Resistance to dissolution
of metallization)
IEC 60068-2-58
*Solder bath temperature：260 ± 5°C
*Leaching immersion time：30 ± 0.5 sec
*Solder : SN63A
Loss of metallization on the edges of each
electrode shall not exceed 25%.
Resistance to soldering heat
JIS C 0050-5.4
*Preheating temperature：120~150℃,
1 minute.
*Solder temperature：270±5°C
*Immersion time：10±1 sec
*Solder：Sn3Ag0.5Cu for lead-free
Measurement to be made after keeping at
room temperature for 24±2 hrs
No mechanical damage.
Samples shall satisfy electrical specification
after test.
Loss of metallization on the edges of each
electrode shall not exceed 25%.
Drop Test
JIS C 0044
*Height：75 cm
*Test Surface：
Rigid surface of concrete or
steel.
*Times：6 surfaces for each units；
for each side.
No mechanical damage.
Samples shall satisfy electrical specification
after test.
Adhesive Strength
of Termination
JIS C 0051- 7.4.3
*Pressurizing force：
5N(≦0603)；10N(>0603)
*Test time：10±1 sec
No remarkable damage or removal of the
termination.
Bending test
JIS C 0051- 7.4.1
The middle part of substrate shall be
pressurized by means of the pressurizing
rod at a rate of about 1 mm/s per second
until the deflection becomes 1mm/s and
then pressure shall be maintained for 5±1
sec.
Measurement to be made after keeping at
room temperature for 24±2 hours
No mechanical damage.
Samples shall satisfy electrical specification
after test.
