LTC5576
16
5576fa
For more information www.linear.com/LTC5576
applicaTions inForMaTion
Figure 6. LO Port Return Loss
Measured return loss of the LO port is shown in Figure 6
for a C4 value of 100pF. Without C5, the return loss is bet-
ter than 10dB from 100MHz to beyond 4GHz. The addition
of
0.3pF at C5 extends the 10dB match to beyond 8GHz.
Figure 7. OUT Port with External Matching
External components C6 and L2 are used to optimize the
impedance for the desired frequency range. High-Q com-
ponents should be used here to minimize the impact on
conversion gain. T
able 2 lists the single-ended reflection
coefficients and impedances of the OUT port and T
able 3
lists component values for several application frequencies.
In Figure 8, return loss is plotted for several of these values.
Table 2. OUT Port Impedance vs Frequency
FREQ
(MHz)
IMPEDANCE (Ω) REFL COEFF
REAL* IMAG* MAG ANGLE
2500 12.8 51.8 0.78 86
3000 24.9 68.1 0.72 68
3500 50.7 80.7 0.63 51
4000 94.6 61.6 0.48 31
4500 89.5 4.7 0.29 5
5000 55.8 –8.0
0.09 –50
5500 38.7 –2.0 0.13 –169
6000 32.0 6.6 0.23 155
6500 30.6 16.5 0.31 128
7000 34.1 27.9 0.36 101
7500 41.2 39.4 0.41 79
8000 51.1 51.7 0.46 62
8500 62.5 57.7 0.47 51
*Series Impedance: Z = REAL + jIMAG
Table 3. Output Component Values
FREQ
(MHz)
12dB RL BAND
(MHz)
VALUES
C6
L2
3000 2800 to 3200 Open 0.5pF (C)
3500 3360 to 3830 6.8nH (L) 0.5pF (C)
5000 4000 to 6700 3.3nH (L) 0.6pF (C)
5200 4700 to 5800 Open
5800 4870 to 7040 0.2pF
8000 7500 to 8700 0.2pF 1nH
OUT
50Ω
5576 F07
LTC5576
C6
L2
10
V
CC
OUT
FREQUENCY (MHz)
0
RETURN LOSS (dB)
0
–10
–5
–15
–20
–25
5576 F06
80002000 4000 6000
EN = ON
C5 = 0.3pF
EN = OFF
OUT Port
The LTC5576 uses an on-chip balun to provide a single-
ended output, as shown in Figure 7. The output is opti
-
mized for 4GHz to 6GHz applications, but may be used for
output frequencies as low as 3GHz, and as high as 8GHz.
LTC5576
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Figure 10. Current Adjust Pin Interface
applicaTions inForMaTion
DC and RF Grounding
The LTC5576 relies on the backside ground of the package
for both RF and thermal performance. The exposed pad
must be soldered to the low impedance topside ground
plane of the board. The topside ground should also be con
-
nected to other ground layers to aid in thermal dissipation
and ensure a low inductance RF ground. The
LTC5576
evaluation
board (Figure 2) utilizes a four by four array of
vias under the exposed pad for this purpose.
Enable Interface
Figure 9 shows a simplified schematic of the EN interface.
To enable the part, the applied EN voltage must be greater
than 1.8V. Setting the voltage to below 0.5V will disable
the IC. If the enable function is not required, the enable
pin can be connected directly to V
CC
. If the enable pin
is left floating, an internal 300k pull-down resistor will
disable the IC.
The voltage at the enable pin should never exceed the
power supply voltage (V
CC
) by more than 0.3V, otherwise
supply current may be sourced through the upper ESD
diode. Under no circumstances should voltage be applied
to the enable pin before the supply voltage is applied to
the V
CC
pin. If this occurs, damage to the IC may result.
Figure 8. OUT Port Return Loss Tuned for (A) 3000MHz,
(B) 3500MHz, (C) 5200MHz, (D) 5800MHz, (E) 8000MHz
Figure 9. EN Pin Interface
Current Adjust Pin (IADJ)
The IADJ pin (Pin 8) can be used to optimize the perfor-
mance of the mixer. The nominal open-circuit DC voltage
on this pin is
1.8V
and the typical short-circuit current is
1.9mA. As shown in Figure 10, an internal 4mA reference
sets the current in the mixer core. Connecting R1 to the
IADJ pin shunts some of this current to ground, thus
reducing the mixer core current. The optimum value of
R1 depends on the supply voltage and LO injection (low
side or high side). Some recommended values are shown
in Table 4 but the values can be optimized as required for
individual applications.
5576 F09
LTC5576
5
300k
50k
V
CC
EN
5576 F10
LTC5576
R1
V
CC
4mA
IADJ
715Ω
8
BIAS
FREQUENCY (MHz)
2500
RETURN LOSS (dB)
0
–10
–5
–15
–20
5576 F08
8500
55003500 4500 6500 7500
A
B
C
D
E
LTC5576
18
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For more information www.linear.com/LTC5576
Figure 11. TEMP Pin Voltage vs Junction Temperature
applicaTions inForMaTion
Table 4. Recommended R1 Values
V
CC
(V) f
IN
(MHz) f
OUT
(MHz) f
LO
(MHz) R1 (Ω)
3.3 456 3500 3044 511
3.3 900 5800 4900 649
3.3 900 8000 7100 649
5.0 456 3500 3044 2.61k
5.0 900 5800 4900 2.61k
5.0 1300 5000 6300 2.61K
Temperature Monitor Pin (TEMP)
The TEMP pin (pin 1) is connected to an on-chip diode that
can be used as a coarse temperature monitor by forcing
current into it and measuring the resulting voltage. The
temperature diode is protected by a series 30Ω resistor and
additional ESD diodes to ground. The TEMP pin voltage is
shown as a function of junction temperature in Figure 11.
Given the voltage at the pin, V
TEMP
, (in mV) the junction
temperature in °C can be estimated for forced input cur-
rents of 10µA and 80µA using the following equations:
T
J
(10µA) = (742.4 – V
TEMP
)/1.796
T
J
(80µA) = (795.6 – V
TEMP
)/1.609
Supply Voltage Ramping
Fast ramping of the supply voltage can cause a current
glitch in the internal ESD protection circuits. Depending on
the supply inductance, this could result in a supply volt
-
age transient that exceeds the maximum rating. A supply
voltage ramp time of greater than
1ms
is recommended.
It is recommended that the EN pin be used to enable or
disable the LTC5576 with V
CC
held constant. However,
if the EN pin and V
CC
are switched simultaneously, then
the configuration shown in Figure 12 is recommended.
A maximum V
CC
ramp rate at pins 6 and 7 of 20V/ms is
recommended.
JUNCTION TEMPERATURE (°C)
–50
TEMP PIN VOLTAGE (mV)
800
850
750
700
650
600
9070503010–10–30 110
550
500
900
5576 F11
I
IN
= 80µA
I
IN
= 10µA
Figure 12. Suggested Configuration for Simultaneous V
CC
and EN Switching
Auto Supply Voltage Detection
An internal circuit automatically detects the supply volt-
age and configures internal components for 3.3V or 5V
operation. The DC current is affected when the auto-detect
circuit switches at approximately 4.1V. To avoid undesired
operation, the mixer should only be operated in the 3.1V
to 3.5V or 4.5V to 5.3V supply ranges.
Spurious Output Levels
Mixer spurious output levels vs harmonics of the IN and
LO frequencies are tabulated in Tables 5 and 6 for the 5V,
5800MHz application. Results are shown for spur frequen
-
cies up to 18GHz. The spur frequencies can be calculated
using the following equation:
f
SPUR
= |M f
IN
± N f
LO
|
Table 5 lists the difference spurs (f
SPUR
= |M f
IN
N
f
LO
|) and Table 6 lists the sum spurs (f
SPUR
= |M f
IN
+
N f
LO
|). The spur levels were measured on a standard
evaluation board at room temperature using the test circuit
of Figure 1.
The spurious output levels for any application will be de
-
pendent on the external matching circuits and the particular
application frequencies.
5576 F12
LTC5576
5 6 7
220µF
0.5Ω
10k
10nF
V
CC
SUPPLY
V
CC
V
CC
EN

LTC5576IUF#PBF

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
RF Mixer 3GHz to 8GHz High Linearity Active Upconverting Mixer
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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