UPC8178TB-EV24

SILICON RFIC
LOW CURRENT AMPLIFIER
FOR MOBILE COMMUNICATIONS
UPC8178TB
DESCRIPTION
The UPC8178TB is a silicon monolithic integrated circuit
designed as an amplifier for mobile communications. This IC
can realize low current consumption with an external chip
inductor which cannot be realized on an internal 50 wideband
matched IC. This low current amplifier operates on 3.0 V. This
device is manufactured using NEC's 30 GHz fmax UHS0 (Ultra
High Speed Process) silicon bipolar process which uses direct
silicon nitride passivation film and gold electrodes. These
materials can protect the chip surface from pollution and
prevent corrosion/migration. Thus, this IC has excellent perfor-
mance, uniformity and reliability.
NEC's stringent quality assurance and test procedures ensure
the highest reliability and performance.
California Eastern Laboratories
APPLICATIONS
Buffer Amplifiers on 0.1 to 2.4 GHz mobile
communications system
PART NUMBER UPC8178TB
PACKAGE OUTLINE S06
SYMBOLS PARAMETERS AND CONDITIONS
1
UNITS MIN TYP MAX
ICC Circuit Current (no signal) mA 1.4 1.9 2.4
GP f = 1.0 GHz dB 9.0 11.0 13.0
Power Gain f = 1.9 GHz dB 9.0 11.5 13.5
f = 2.4 GHz dB 9.0 11.5 13.5
ISOL f = 1.0 GHz dB 34 39
Isolation f = 1.9 GHz dB 35 40
f = 2.4 GHz dB 33 38
PO(1dB) f = 1.0 GHz dBm -8.0 -4.0
1 dB Gain Compression Output Power f = 1.9 GHz dBm -11.0 -7.0
f = 2.4 GHz dBm -11.5 -7.5
NF f = 1.0 GHz dB 5.5 7.0
Noise Figure f = 1.9 GHz dB 5.5 7.0
f = 2.4 GHz dB 5.5 7.0
RLin f = 1.0 GHz dB 4 7
Input Return Loss f = 1.9 GHz dB 5 8
f = 2.4 GHz dB 6.5 9.5
ELECTRICAL CHARACTERISTICS
(TA = 25°C, VCC = VOUT = 3.0 V, ZS = ZL = 50 , at LC matched frequency unless otherwise specified))
LOW CURRENT CONSUMPTION
ICC = 1.9 mA TYP @ VCC = 3.0 V
SUPPLY VOLTAGE:
VCC = 2.4 to 3.3 V
EXCELLENT ISOLATION:
ISOL = 39 dB TYP @ f = 1.0 GHz
ISOL = 40 dB TYP @ f = 1.9 GHz
ISOL = 38 dB TYP @ f = 2.4 GHz
POWER GAIN:
G
P = 11.0 dB TYP @ f = 1.0 GHz
GP = 11.5 dB TYP @ f = 1.9 GHz
G
P = 11.5 dB TYP @ f = 2.4 GHz
OPERATING FREQUENCY:
0.1 to 2.4 GHz (Output port LC matching)
1 dB GAIN COMPRESSION OUTPUT POWER:
PO(1 dB) = -4.0 dBm TYP @ f = 1.0 GHz
PO(1 dB) = -7.0 dBm TYP @ f = 1.9 GHz
PO(1 dB) = -7.5 dBm TYP @ f = 2.4 GHz
HIGH-DENSITY SURFACE MOUNTING:
6-pin super minimold package (2.0 x 1.25 x 0.9 mm)
LOW WEIGHT:
7 mg (Standard Value)
FEATURES
+20
+10
0
-10
-20
-30
-40
0.1
1.00.3
3.0
T
A
= -40°C
T
A
= +85°C
T
A
= +25°C
V
CC
= 3.0 V
1.9 GHz
2.4 GHz
1.0 GHz
POWER GAIN vs. FREQUENCY
SYMBOLS PARAMETERS UNITS MIN TYP MAX
V
CC Supply Voltage
1
V 2.4 3.0 3.3
T
A Operating
Ambient Temperature ˚C -40 +25 +85
ABSOLUTE MAXIMUM RATINGS
1
(TA = +25°C unless otherwise specified)
UPC8178TB
RECOMMENDED
OPERATING CONDITIONS
Note:
1. Same voltage applied to pins 4 and 6.
SYMBOLS PARAMETERS UNITS RATINGS
VCC Supply Voltage
2
V 3.6
I
CC Circuit Current mA 15
PD Power Dissipation
3
mW 270
T
A Operating Ambient °C -40 to +85
Temperature
TSTG Storage Temperature °C -55 to +150
PIN Input Power dBm +5
Notes:
1. Operation in excess of any one of these conditions may result in
permanent damage.
2. Pins 4 and 6.
3. Mounted on a double-sided copper clad 50x50x1.6 mm epoxy
glass PWB, TA = +85°C.
Pin Pin Applied Pin Function and Applications Internal Equivalent Circuit
No. Name Voltage Voltage
(V) (V)
1 Input 0.91
2 GND 0
3
5
4 Output Voltage
same as
VCC
through
external
inductor
6VCC 2.4 to 3.3
PIN FUNCTIONS (Pin Voltage is measured at VCC = 3.0 V)
Ground pin. This pin should be connected to the
system ground with minimum inductance. Ground
pattern on the board should be formed as wide
as possible. All the ground pins must be
connected together with a wide ground pattern to
decrease impedance difference.
Signal input pin. An internal matching circuit,
configured with resistors, enables a 50
connection over a wide band. This pin must be
coupled to the signal source with the capacitor for
DC out.
Signal output pin. This pin is designed as the
collector output. Due to the high impedance
output, this pin should be externally equipped
with LC matching circuit to next stage. For L, a
size 1005 chip inductor can be used.
Power supply pin. This pin should be externally
equipped with a bypass capacitor to minimize it's
impedance.
1
4
6
3
5
2
Parameter 1.0 GHz output port 1.66 GHz output port 1.9 GHz output port 2.4 GHz output port Marking
matching frequency matching frequency matching frequency matching frequency
ICC GP ISOL PO(1 dB) GP ISOL PO(1 dB) GP ISOL PO(1 dB) GP ISOL PO(1 dB)
Part No. (mA) (dB) (dB) (dBm) (dB) (dB) (dBm) (dB) (dB) (dBm) (dB) (dB) (dBm)
UPC8178TB 1.9 11 39 -4.0 11.5 40 -7.0 11.5 38 -7.5 C3B
UPC8179TB 4.0 13.5 44 +3.0 15.5 42 +1.5 15.5 41 +1.0 C3C
UPC8128TB 2.8 12.5 39 -4.0 13 39 -4.0 13 37 -4.0 C2P
UPC8151TB 4.2 12.5 38 +2.5 15 36 +1.5 15 34 +0.5 C2U
UPC8152TB 5.6 23 40 -4.5 19.5 38 -8.5 17.5 35 -8.5 C2V
SERIES PRODUCTS
1
(TA = +25°C, VCC = Vout = 3.0 V, ZS = ZL = 50 )
Note:
1. Typical performance.
TEST CIRCUIT 1 (f = 1.0 GHz)
UPC8178TB
EXAMPLE OF TEST CIRCUIT 1 ASSEMBLED ON EVALUATION BOARD
1.0 GHz Output Port Matching
C1, C3, C5 1000 pF
C2 0.75 pF
C4 10 pF
L1 12 nH
COMPONENT LIST
VCC
C3
C1
C4
C2
C3
1
6
4
L
1
Output port matching circuit
50
OUT
50
IN
2, 3, 5
C
1
C
4
C
2
C
5
C
3
L
1
C3B
Connector
Top View
AMP. 4
Connector
IN
OUT
Mounting direction
f = 1.0 GHz

UPC8178TB-EV24

Mfr. #:
Manufacturer:
CEL
Description:
RF Development Tools For UPC8178TB-A at 2.49 GHz
Lifecycle:
New from this manufacturer.
Delivery:
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