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CPC1909J

P1-P3P4-P6P7-P7
I
NTEGRATED
C
IRCUITS
D
IVISION
R08 www.ixysic.com 4
CPC1909
3 Performance Data @ 25°C (Unless Otherwise Noted)
Unless otherwise specified, all performance data was acquired without the use of a heat sink.
The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the
written specifications, please contact our application department.
35
30
25
20
15
10
5
0
1.30 1.31 1.32 1.33 1.34
LED Forward Voltage (V)
Device Count (N)
Typical LED Forward Voltage Drop
(N=50, I
F
=10mA, I
L
=1A
DC
)
35
30
25
20
15
10
5
0
10.0 12.5 15.0 20.017.5 22.5
Typical Turn-On Time
(N=50, I
F
=20mA, I
L
=1A
DC
)
Turn-On (ms)
Device Count (N)
0.23 0.35 0.470.17 0.29 0.41
25
20
15
10
5
0
Turn-Off (ms)
Device Count (N)
Typical Turn-Off Time
(N=50, I
F
=20mA, I
L
=1A
DC
)
35
30
25
20
15
10
5
0
0.033 0.037 0.041 0.045 0.049 0.053
On-Resistance (Ω)
Typical On-Resistance Distribution
(N=50, I
F
=10mA, I
L
=1A
DC
)
Device Count (N)
LED Forward Current (mA)
0
5 1015202530354045
120
100
80
60
40
20
0
50
Turn-On (ms)
Typical Turn-On Time
vs. LED Forward Current
(I
L
=1A
DC
)
LED Forward Current (mA)
0
5 1015202530354045
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.00
50
Turn-Off (ms)
Typical Turn-Off Time
vs. LED Forward Current
(I
L
=1A
DC
)
LED Current (mA)
-40
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100
Typical I
F
for Switch Operation
vs. Temperature
(I
L
=1A
DC
)
Temperature (ºC)
-40
42
36
30
24
18
12
6
0
-20 0 20 40 60 80 100
Temperature (ºC)
Turn-On (ms)
Typical Turn-On Time vs. Temperature
(I
L
=1A
DC
)
I
F
=10mA
I
F
=20mA
I
NTEGRATED
C
IRCUITS
D
IVISION
5 www.ixysic.com R08
CPC1909
Unless otherwise specified, all performance data was acquired without the use of a heat sink.
The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the
written specifications, please contact our application department.
-40
0.060
0.058
0.056
0.054
0.052
0.050
0.048
0.046
0.044
-20 0 20 40 60 80 100
On-resistance (Ω)
Typical On-Resistance
vs. Temperature
(I
F
=10mA, I
L
=1A
DC
)
Temperature (ºC)
Load Current (A)
-0.54
10
8
6
4
2
0
-2
-4
-6
-8
-10
-0.36 -0.18 0.18 0.36
0
0.54
Load Voltage (V)
Typical Load Current
vs. Load Voltage
(I
F
=10mA)
020406080 100
0
5
10
15
20
1ºC/W
5ºC/W
10ºC/W
No Heat Sink
Temperature (ºC)
Load Current (A
rms
)
Maximum Load Current
vs. Temperature with Heat Sink
(I
F
=20mA)
-40
84
82
80
78
76
74
72
70
68
-20 0 20 40 60 80 100
Normalized Blocking Voltage
vs. Temperature
Temperature (ºC)
Blocking Voltage (V
P
)
-40
0.014
0.012
0.010
0.008
0.006
0.004
0.002
0
-20 0 20 40 60 80 100
Typical Leakage vs. Temperature
Measured Across Pins 1&2
(V
L
=60V
P
)
Temperature (ºC)
Leakage (μA)
30
25
20
15
10
5
0
1ms10µs 100µs 100ms 10s10ms 1s 100s
Time
Load Current (A
P
)
Energy Rating Curve
Free Air, No Heat Sink
I
NTEGRATED
C
IRCUITS
D
IVISION
R08 www.ixysic.com 6
CPC1909
4 Manufacturing Information
4.1 Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the
latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee
proper operation of our devices when handled according to the limitations and information in that standard as well as
to any limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to
the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
4.2 ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard
JESD-625.
4.3 Soldering Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020 must be observed.
NOTE: The exposed surface of the DCB substrate is not to be soldered.
4.4 Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an
optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a
wash is used after solder reflow processes. Chlorine-based or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
Device Moisture Sensitivity Level (MSL) Rating
CPC1909J MSL 1
Device Maximum Temperature x Time
CPC1909J 245°C for 30 seconds
e
3
P1-P3P4-P6P7-P7

CPC1909J

Mfr. #:
Buy CPC1909J
Manufacturer:
IXYS Integrated Circuits
Description:
Solid State Relays - PCB Mount 60V Single Pole 60V Power Relay
Lifecycle:
New from this manufacturer.
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