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XC6804 Series
● SOP-8FD Power Dissipation
Board Mount (Tj max = 125°C)
Ambient Temperature (°C) Power Dissipation Pd (mW) Thermal Resistance (°C /W)
25 1500
66.67
85 600
Pd vs.Ta
0
200
400
600
800
1000
1200
1400
1600
25 45 65 85 105 125
Ambient Temperature Ta (℃)
Power Dissipation Pd (mW)
Evaluation Board (Unit: mm)
2. Power Dissipation vs. Ambient temperature
40.0
2.5
28.9
Power dissipation data for the SOP-8FD is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
1. Measurement Condition (Reference data)
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board: Dimensions 40 x 40 mm (1600 mm
2
in one side)
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
Material: Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 4 x 0.8 Diameter
