HEXFET
®
Power MOSFET
V
DSS
= 55V
R
DS(on)
= 5.3m
I
D
= 95A
12/22/03
www.irf.com 1
AUTOMOTIVE MOSFET
PD - 95810
Specifically designed for Automotive applications, this HEXFET
®
Power MOSFET utilizes the latest processing techniques to
achieve extremely low on-resistance per silicon area. Additional
features of this design are a 175°C junction operating tempera-
ture, fast switching speed and improved repetitive avalanche
rating . These features combine to make this design an extremely
efficient and reliable device for use in Automotive applications and
a wide variety of other applications.
S
D
G
Description
Advanced Process Technology
Ultra Low On-Resistance
175°C Operating Temperature
Fast Switching
Repetitive Avalanche Allowed up to Tjmax
Features
HEXFET
®
is a registered trademark of International Rectifier.
* R
θ
is measured at T
J
approximately 90°C
IRFP1405
TO-247AC
S
D
G
Absolute Maximum Ratin
g
s
Parameter Units
I
D
@ T
C
= 25°C
Continuous Drain Current, V
GS
@ 10V (Silicon Limited)
I
D
@ T
C
= 100°C
Continuous Drain Current, V
GS
@ 10V
A
I
D
@ T
C
= 25°C
Continuous Drain Current, V
GS
@ 10V (Package Limited
)
I
DM
P
u
l
se
d
D
ra
i
n
C
urren
t
P
D
@T
C
= 25°C
Power Dissipation W
Linear Derating Factor W/°C
V
GS
Gate-to-Source Volta
g
e V
E
AS (Thermally limited)
Si
n
gl
e
P
u
l
se
A
va
l
anc
h
e
E
ner
gy
mJ
E
AS
(Tested )
Si
n
gl
e
P
u
l
se
A
va
l
anc
h
e
E
ner
gy
T
es
t
e
d
V
a
l
ue
I
AR
A
va
l
anc
h
e
C
urren
t
A
E
AR
R
epe
titi
ve
A
va
l
anc
h
e
E
ner
gy
mJ
T
J
Operatin
Junction and
T
STG
Stora
g
e Temperature Ran
g
C
Soldering Temperature, for 10 seconds
Mounting Torque, 6-32 or M3 screw
Thermal Resistance
Parameter Typ. Max. Units
R
θJC
Junction-to-Case * ––– 0.49
R
θcs
Case-to-Sink, Flat, Greased Surface 0.24 ––– °C/W
R
θJA
Junction-to-Ambient * ––– 40
1060
530
See Fig.12a, 12b, 15, 16
310
2.0
± 20
Max.
160
110
640
95
-55 to + 175
300 (1.6mm from case )
10 lbf in (1.1N m)
IRFP1405
2 www.irf.com
S
D
G
Electrical Characteristics @ T
J
= 25°C (unless otherwise specified)
Parameter Min. Typ. Max. Units
V
(BR)DSS
Drain-to-Source Breakdown Voltage 55 ––– ––– V
V
(BR)DSS
/
T
J
Breakdown Voltage Temp. Coefficient ––– 0.058 ––– V/°C
R
DS(on)
Static Drain-to-Source On-Resistance ––– 4.2 5.3
m
V
GS(th)
Gate Threshold Voltage 2.0 –– 4.0 V
gfs Forward Transconductance 77 ––– S
I
DSS
Drain-to-Source Leakage Current ––– ––– 20 µA
––– ––– 250
I
GSS
Gate-to-Source Forward Leakage ––– ––– 200 nA
Gate-to-Source Reverse Leakage ––– ––– -200
Q
g
Total Gate Charge ––– 120 180
Q
gs
Gate-to-Source Charge ––– 30 ––– nC
Q
gd
Gate-to-Drain ("Miller") Charge ––– 53 ––
t
d(on)
Turn-On Delay Time ––– 12 –––
t
r
Rise Time ––– 160 –––
t
d(off)
Turn-Off Delay Time ––– 140 ––– ns
t
f
Fall Time –– 150 –––
L
D
Internal Drain Inductance ––– 5.0 –– Between lead,
nH 6mm (0.25in.)
L
S
Internal Source Inductance ––– 13 –– from package
and center of die contact
C
iss
Input Capacitance ––– 5600 ––
C
oss
Output Capacitance ––– 1310 ––
C
rss
Reverse Transfer Capacitance ––– 350 ––– pF
C
oss
Output Capacitance ––– 6550 ––
C
oss
Output Capacitance ––– 920 –––
C
oss
eff.
Effective Output Capacitance ––– 1750 ––
Source-Drain Ratin
g
s and Characteristics
Parameter Min. Typ. Max. Units
I
S
Continuous Source Current ––– ––– 95
(Body Diode) A
I
SM
Pulsed Source Current ––– ––– 640
(Body Diode)
V
SD
Diode Forward Voltage –– ––– 1.3 V
t
rr
Reverse Recovery Time ––– 70 110 ns
Q
rr
Reverse Recovery Charge ––– 170 260 nC
t
on
Forward Turn-On Time Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
V
GS
= 0V, V
DS
= 1.0V, ƒ = 1.0MHz
V
GS
= 0V, V
DS
= 44V, ƒ = 1.0MHz
V
GS
= 0V, V
DS
= 0V to 44V
V
GS
= 10V
V
DD
= 28V
I
D
= 95A
R
G
= 2.6
T
J
= 25°C, I
S
= 95A, V
GS
= 0V
T
J
= 25°C, I
F
= 95A, V
DD
= 28V
di/dt = 100A/µs
Conditions
V
GS
= 0V, I
D
= 250µA
Reference to 25°C, I
D
= 1mA
V
GS
= 10V, I
D
= 95A
V
DS
= V
GS
, I
D
= 250µA
V
DS
= 55V, V
GS
= 0V
V
DS
= 55V, V
GS
= 0V, T
J
= 125°C
MOSFET symbol
showing the
integral reverse
p-n junction diode.
V
DS
= 25V, I
D
= 95A
I
D
= 95A
V
DS
= 44V
Conditions
V
GS
= 10V
V
GS
= 0V
V
DS
= 25V
ƒ = 1.0MHz
V
GS
= 20V
V
GS
= -20V
Repetitive rating; pulse width limited by
max. junction temperature. (See fig. 11).
Limited by T
Jmax
, starting T
J
= 25°C, L = 0.12mH
R
G
= 25, I
AS
= 95A, V
GS
=10V. Part not
recommended for use above this value.
Pulse width 1.0ms; duty cycle 2%.
Notes:
C
oss
eff. is a fixed capacitance that gives the same charging time
as C
oss
while V
DS
is rising from 0 to 80% V
DSS
.
Limited by T
Jmax
, see Fig.12a, 12b, 15, 16 for typical repetitive
avalanche performance.
This value determined from sample failure population. 100%
tested to this value in production.
IRFP1405
www.irf.com 3
Fig 2. Typical Output CharacteristicsFig 1. Typical Output Characteristics
Fig 3. Typical Transfer Characteristics
Fig 4. Typical Forward Transconductance
Vs. Drain Current
0 1 10 100
0.1 1 10 100
V
DS
, Drain-to-Source Voltage (V)
10
100
1000
I
D
,
D
r
a
i
n
-
t
o
-
S
o
u
r
c
e
C
u
r
r
e
n
t
(
A
)
60µs PULSE WIDTH
Tj = 175°C
4.5V
VGS
TOP 15V
10V
8.0V
7.0V
6.0V
5.5V
5.0V
BOTTOM 4.5V
4.0 5.0 6.0 7.0 8.0 9.0 10.0
V
GS
, Gate-to-Source Voltage (V)
10
100
1000
I
D
,
D
r
a
i
n
-
t
o
-
S
o
u
r
c
e
C
u
r
r
e
n
t
(
Α
)
V
DS
= 25V
60µs PULSE WIDTH
T
J
= 25°C
T
J
= 175°C
0.1 1 10 100
V
DS
, Drain-to-Source Voltage (V)
1
10
100
1000
I
D
,
D
r
a
i
n
-
t
o
-
S
o
u
r
c
e
C
u
r
r
e
n
t
(
A
)
60µs PULSE WIDTH
Tj = 25°C
4.5V
VGS
TOP 15V
10V
8.0V
7.0V
6.0V
5.5V
5.0V
BOTTOM 4.5V
0 20406080100
I
D,
Drain-to-Source Current (A)
0
20
40
60
80
100
120
140
G
f
s
,
F
o
r
w
a
r
d
T
r
a
n
s
c
o
n
d
u
c
t
a
n
c
e
(
S
)
T
J
= 25°C
T
J
= 175°C
V
DS
= 10V
380µs PULSE WIDTH

IRFP1405

Mfr. #:
Manufacturer:
Infineon Technologies
Description:
MOSFET N-CH 55V 95A TO-247AC
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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