HMPP-386x Series
MiniPak Surface Mount RF PIN Diodes
Data Sheet
Description/Applications
These ultra-miniature products represent the blending of
Avago Technologies’ proven semiconductor and the latest
in leadless packaging technology.
The HMPP-386x series of general purpose PIN diodes are
designed for two classes of applications. The rst is attenu-
ators where current consumption is the most important
design consideration. The second application for this
series of diodes is in switches where low capacitance with
no reverse bias is the driving issue for the designer.
The low dielectric relaxation frequency of the HMPP-386x
insures that low capacitance can be reached at zero volts
reverse bias at frequencies above 1 GHz, making this PIN
diode ideal for hand held applications.
Low junction capacitance of the PIN diode chip, combined
with ultra low package parasitics, mean that these products
may be used at frequencies which are higher than the upper
limit for conventional PIN diodes.
Note that Avago’s manufacturing techniques assure that
dice packaged in pairs are taken from adjacent sites on
the wafer, assuring the highest degree of match.
Minipak 1412 is a ceramic based package, while Minipak
QFN is a leadframe based package.
Package Lead Code Identication (Top View)
Features
• Surface mount MiniPak package
• Better thermal conductivity for higher power dissipa-
tion
• Single and dual versions
• Matched diodes for consistent performance
• Low capacitance at zero volts
• Low resistance
• Low FIT (Failure in Time) rate*
• Six-sigma quality level
* For more information, see the Surface Mount Schottky Reliability
Data Sheet.
Pin Connections and Package Marking
Notes:
1. Package marking provides orientation and identication.
2. See “Electrical Specications” for appropriate package marking.
Single
3
2
4
1
#0
Anti-parallel
3
2
4
1
#2
Parallel
3
2
4
1
#5
(Minipak 1412) (Minipak 1412) (Minipak 1412)
3
2
Product code Date code
4
AA
1
