DESIGNED & DIMENSIONED
IN MILLIMETERS[INCHES]
DO NOT
SCALE FROM
THIS PRINT
-HN: HEAVY GOLD/NICKEL (SEE NOTE 5 & 6)
(MCX7-J-P-H-RA-TH1-SKT)
(MCX-SHL-001-F)
(MCX7-J-P-N-RA-TH1-BDY)
-H: HEAVY GOLD (SEE NOTE 5 & 6)
(MCX7-J-P-H-RA-TH1-SKT)
(MCX-SHL-001-F)
(MCX7-J-P-F-RA-TH1-BDY)
GENDER
-J: JACK
TYPE
-P: PCB
PLATING SPECIFICATION
TERMINATION
-TH1: THROUGH HOLE
ORIENTATION
-RA: RIGHT ANGLE
MCX7-J-P-XX-RA-TH1
5.08 .200
1.10 .043
5.08 .200
1.40 .055
(4 PLCS)
RECOMMENDED PCB LAYOUT
9.20 .362
(REF)
3.50 .138
(REF)
0.92 .036
(REF)
2.70 .106
(REF)
0.50 .020
(REF)
0.79 .031
(REF)
5.08 .200
(REF)
'B'
"A"
"A"
0.45
-
0.03
+
0.02
.018
-
.001
+
.001
DETAIL 'B'
SCALE 16 : 1
4.50 .177
(REF)
9.50
±0.10
.374
±.004
1.50 .059
(REF)
6.50 .256
(REF)
6.00
(REF)
.236
C3
3.20
(TO CENTER CONTACT)
.126
3.45
(REF)
.136
4.06 .160
(REF)
SECTION "A"-"A"
SCALE 4 : 1
BODY
(MCX7-J-P-X-RA-TH1-BDY)
SOCKET
(MCX7-J-P-X-RA-TH1-SKT)
INSULATOR 1
(MCX7-J-P-RA-TH1-INS)
SHELL
(MCX-SHL-001-X)
INSULATOR 2
(MCX7-INS-002)
FLUSH ±0.10
2.70
(REF)
.106
TO CENTER CONTACT
1.36
-
0.05
+
0.10
.054
-
.002
+
.004
TO CENTER CONTACT
DETAIL 'C'
SCALE 8 : 1
MCX7-J-P-H-RA-TH1
(SHOWN)
C
SHEET OF
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN MILLIMETERS.
TOLERANCES ARE:
DECIMALS ANGLES
.X:
0.3 [.01] 2
.XX:
0.13 [.005]
.XXX:
0.051 [.0020]
MATERIAL:
MCX RIGHT ANGLE, THROUGH HOLE JACK- 75 OHM
BY:
MCX7-J-P-XX-RA-TH1
DWG. NO.
DESCRIPTION:
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
DO NOT SCALE DRAWING
R MUSSER
02/06/2008
1
1
SHEET SCALE: 5:1
F:\DWG\MISC\Mktg\MCX7-J-P-XX-RA-TH1-MKT.SLDDRW
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733 FAX: 812-948-5047
e-Mail: info@SAMTEC.com code: 55322
NOTES:
1. REPRESENTS A CRITICAL DIMENSION.
2. PUSHOUT FORCE FOR INSULATOR: 20 N[4.5 LB] MIN.
3. PARTS TO BE PACKAGED IN TRAYS; IF QUANTITY IS LESS THAN HALF
TRAY, PARTS TO BE PACKAGED IN COHESIVE FOAM.
4. RoHs COMPLIANT.
5. COMPONENT PLATING DESIGNATIONS:
-H: 0.00076[0.000030] (MIN) GOLD OVER 0.00127[0.000050] (MIN) NICKEL.
-F: 0.00008[0.000003] (MIN) GOLD OVER 0.00127[0.000050] (MIN) NICKEL.
-N: 0.00254[0.000100] (MIN) NICKEL.
6. ASSEMBLY PLATING DESIGNATIONS:
-HN: (CENTER CONTACT)-H:
(OUTER CONTACT)-F:
(REMAINING METAL PARTS)-N:
-H: (CENTER CONTACT)-H:
(OUTER CONTACT)-F:
(REMAINING METAL PARTS)-F:
REVISION C
