TC1070/TC1071/TC1187
DS21353E-page 14 2010 Microchip Technology Inc.
APPENDIX A: REVISION HISTORY
Revision E (November 2010)
The following is the list of modifications:
1. Added thermal package resistance in
Termperature Characteristics table.
2. Updated Section 3.4 “Output Voltage Adjust
(ADJ)”.
3. Updated Figure 4-1.
4. Added new section Section 4.3 “Input Capaci-
tor”.
Revision D (March 2007)
The following is the list of modifications:
1. Ground current changed to 50 µA.
2. Package type changed to SOT-23.
3. Section 3.0 “Pin Descriptions”: Added pin
descriptions.
4. Section 6.0 “Packaging Information”:
Updated packaging information.
Revision C (January 2006)
• Undocumented changes.
Revision B (May 2002)
• Undocumented changes.
Revision A (March 2002)
• Original Release of this Document.
