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74LVT241PW,112

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P17
74LVT241_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 7 May 2008 12 of 16
NXP Semiconductors
74LVT241
3.3 V octal buffer/line driver; 3-state
Fig 11. Package outline SOT360-1 (TSSOP20)
UNIT A
1
A
2
A
3
b
p
cD
(1)
E
(2) (1)
eH
E
LL
p
QZywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
6.6
6.4
4.5
4.3
0.65
6.6
6.2
0.4
0.3
0.5
0.2
8
0
o
o
0.13 0.10.21
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT360-1 MO-153
99-12-27
03-02-19
w M
b
p
D
Z
e
0.25
110
20
11
pin 1 index
θ
A
A
1
A
2
L
p
Q
detail X
L
(A )
3
H
E
E
c
v M
A
X
A
y
0 2.5 5 mm
scale
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
SOT360-1
A
max.
1.1
74LVT241_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 7 May 2008 13 of 16
NXP Semiconductors
74LVT241
3.3 V octal buffer/line driver; 3-state
Fig 12. Package outline SOT764-1 (DHVQFN20)
terminal 1
index area
0.51
A
1
E
h
b
UNIT
ye
0.2
c
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
4.6
4.4
D
h
3.15
2.85
y
1
2.6
2.4
1.15
0.85
e
1
3.5
0.30
0.18
0.05
0.00
0.05 0.1
DIMENSIONS (mm are the original dimensions)
SOT764-1 MO-241 - - -- - -
0.5
0.3
L
0.1
v
0.05
w
0 2.5 5 mm
scale
SOT764-1
DHVQFN20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
20 terminals; body 2.5 x 4.5 x 0.85 mm
A
(1)
max.
A
A
1
c
detail X
y
y
1
C
e
L
E
h
D
h
e
e
1
b
29
19
12
11
10
1
20
X
D
E
C
B
A
terminal 1
index area
AC
C
B
v
M
w
M
E
(1)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
D
(1)
02-10-17
03-01-27
74LVT241_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 7 May 2008 14 of 16
NXP Semiconductors
74LVT241
3.3 V octal buffer/line driver; 3-state
13. Abbreviations
14. Revision history
Table 10. Abbreviations
Acronym Description
BiCMOS Bipolar Complementary Metal Oxide Semiconductor
CDM Charged Device Model
DUT Device Under Test
ESD ElectroStatic Discharge
HBM Human Body Model
TTL Transistor-Transistor Logic
Table 11. Revision history
Document ID Release date Data sheet status Change notice Supersedes
74LVT241_3 20080507 Product data sheet ECN07_046 74LVT241_2
Modifications:
• The format of this data sheet has been redesigned to comply with the new identity guidelines of
NXP Semiconductors.
• Legal texts have been adapted to the new company name where appropriate.
• DHVQFN20 package added Section 3 “Ordering information” and Section 12 “Package outline”.
74LVT241_2 19980219 Product specification - 74LVT241_1
74LVT241_1 19960529 Product specification - -
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P17

74LVT241PW,112

Mfr. #:
Buy 74LVT241PW,112
Manufacturer:
Nexperia
Description:
Buffers & Line Drivers 3.3V OCTAL BUFFER/
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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