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CPF0805B215KE1
P1-P3
P4-P6
P7-P9
Thin Film Precision Resistors
1773200 CIS
WR 10/2016
Dimensions in
millimetres unless
otherwise specified
Dimensions Shown for
reference purposes only.
Specifications subject to
change
For Email, phone or live chat,
go to: www.te.com/help
Packaging
Packing Quantity and
Reel Specificati
o
n
Size
ØA ±1.0
ØB ±1.0
ØC ±0.7
W ±1.0
T ±1.0
Paper Tape
Embossed Plastic
Tape
0201
178.0
60.0
13.5
9.5
11.5
1000 / 10000
N/A
0402
0603
1000 / 5000
0805
1206
1210
2010
13.5
15.5
N/A
4000
2512
Paper tape Specificati
o
n
Size
A ±0.05
B ±0.05
W
±0.10
E
±0.05
F ±0.05
P
P
P ±.
ØD
T
0201
0.40
0.70
8.00
1.75
3.5
4.00 ±0.10
2.00
±0.05
2.00
1.55 ±0.03
0.42
±0.02
0402
0.70
1.16
1.55 ±0.05
0.40
±0.03
0603
1.10
1.90
4.00
±0.10
0.60
±0.03
0805
1.60
2.37
0.75
±0.05
1206
2.00
3.55
1210
2.75
3.40
4.00 ±0.05
1.60 ±0.10
Thin Film Precision Resistors
1773200 CIS
WR 10/2016
Dimensions in
millimetres unless
otherwise specified
Dimensions Shown for
reference purposes only.
Specifications subject to
change
For Email, phone or live chat,
go to: www.te.com/help
Peel force of top
cover tap
e
The peel spe
ed shall be a
bout 300mm/min±5%
The peel f
orce of top co
ver tape shall be bet
ween 8gf to 60gf
Embossed Plastic Tap
e Specifications
W
E
F
ψ D
0
P
1
P
2
P
0
direction of unreeling
A
B
Top Tape
Resistor
Emboss Tape
T
ψ D
1
1.4Min.
Type
A
B
W
E
F
P
0
P
1
P
2
ØD
0
T
2010
2.85±0.10
5.45±0.10
12.0±0.10
1.75±0.10
5.5±0.05
4.00±0.05
4.00±0.10
2.00±0.05
1.50+0.10
1.00±0.20
2512
3.40±0.10
6.65±0.10
12.0±0.10
1.75±0.10
5.5±0.05
4.00±0.05
4.00±0.10
2.00±0.05
1.50+0.10
1.00±0.20
Peel force of top
cover tap
e
The peel spe
ed shall be a
bout 300mm/min±5%
The peel f
orce of top co
ver tape shall be be
tween 20gf t
o 80g
Thin Film Precision Resistors
1773200 CIS
WR 10/2016
Dimensions in
millimetres unless
otherwise specified
Dimensions Shown for
reference purposes only.
Specifications subject to
change
For Email, phone or live chat,
go to: www.te.com/help
Reel dimension (mm)
Qty / Reel
A ±0.5
B ±0.5
C ±0.5
D ±1
M ±2
W ±1
2000
2
13.5
21
60
178
13.8
Handling Recommendations
When flow soldering -
the land width mus
t be smaller than
the Chip Resistor
width to properly contr
ol the solde
r application. Gene
rally, the land width
can be Chip Resist
or width (W) x 0.
7 to 0.8. When
reflow soldering
–
solder
application amount can be
adjusted. Thus the land wid
th can be set to W
x
1.0 to 1.3.
How To Order
3521
1K0
F
T
Common Part
Resistance Value
Tolerance
Pack Style
1 ohm 1R0
3521
1K ohm 1000 oh
ms
1K0
F
–
1%
J
–
5%
T
–
2000
reel
1 Meg ohm
1000000 ohms
1M0
Reflow Solder Profile
Time of Reflow solder
ing at max
imum temperature point
260°C = 10s
Wave Solder Profile
Time of Wave so
ldering at maximum te
mperature point 26
0°C = 10s
Time of Soldering Iron
at maximum te
mperature point 410°C = 5s
How To Order
CPF
0603
B
100R
E
1
Common Part
Package Size
Tolerance
Value
TCR
Packaging
CPF
- prec
ision
thin film chip
resistor
0201
0402
0603
0805
1206
1210
2010
2512
B
- ±0.1%
D
- ±0.5%
F
- ±1%
100R -
Ω
1K0 -
Ω
10K
–
,Ω
D
–
15PPM
E -
25PPM
C -
50PPM
1
–
1K REEL
Blank
–
standard reel
0201 0402 - 10K
0603 0805 1206 1210
–
5K
2010 2512 -
4K
P1-P3
P4-P6
P7-P9
CPF0805B215KE1
Mfr. #:
Buy CPF0805B215KE1
Manufacturer:
Description:
Thin Film Resistors - SMD CPF0805 215K 0.1% 25PPM 1K RL
Lifecycle:
New from this manufacturer.
Delivery:
DHL
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Ups
TNT
EMS
Payment:
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