92-6040-0027

44 Flux-Cored Wire
Activated Rosin Cored Wire for Lead-Free and Leaded Alloys
Product Description
Kester 44 Rosin Flux is an activated rosin formula for use in ux-cored solder wire. 44 has virtually dominated the eld
of activated rosin core solders for well over ve decades. An outstanding performance feature of this ux is the “instant-
action” wetting behavior. The high mobility and fast-spreading action of this ux results in more reliable production line
soldering. Under IPC J-STD-004, 44 is classied as ROM1. Despite the increased activity and soldering performance, 44
passes both 85°C/85% RH and 40°C/90% RH SIR test methods.
Reliability Properties
Copper Mirror Corrosion: Moderate
Tested to J-STD-004, IPC-TM-650, Method
2.3.32
Corrosion Test: Moderate
Tested to J-STD-004, IPC-TM-650, Method
2.6.15
Silver Chromate: Fail
Tested to J-STD-004, IPC-TM-650, Method
2.6.33
Chloride and Bromides: 0.44%
Tested to J-STD-004, IPC-TM-650, Method
2.6.35
Fluorides by Spot Test: Pass
Tested to J-STD-004, IPC-TM-650, Method
2.6.35.1
Surface Insulation Resistance (SIR)
40°C/90% RH, IPC (typical): Pass
Tested to J-STD-004B, IPC-TM-650, Method
2.6.3.7
Surface Insulation Resistance (SIR),
IPC (typical): Pass
Tested to J-STD-004, IPC-TM-650, Method
2.6.3.3
Test conditions: 85°C, 85% RH, 7 days, 100V
Blank 44
Day 1 7.46*10
9
2.2*10
8
Day 4 4.9*10
9
2.88*10
9
Day 7 7.7*10
9
7.14*10
9
RoHS Compliance
Kester does not determine any applicable Restriction of Hazardous Substances (RoHS) exemptions for our lead
containing products at the user level. (Applies only if this core ux is combined with a lead-free alloy)
Performance Characteristics:
High activity RA formulation
Passes both 85°C/85% RH and
40°C/90% RH IPC SIR testing
Excellent solderability to a wide
range of metalizations
Industry standard RA cored wire for
decades
Classied as ROM1 per J-STD-004
Global Headquarters: 800 West Thorndale Avenue, Itasca, IL USA 60143 Phone: +1 800.2.KESTER Fax: +1 630.616.4044
Asia-Pacific Headquarters: 61 Ubi Avenue 1 #06-01 UB Point, Singapore 408941 Phone: +65 6.449.1133 Fax: +65 6.242.9036
European Headquarters: Ganghofer Strasse 45, 82216 Gernlinden, Germany Phone: +49 (0) 8142 4785 0 Fax: +49 (0) 8142 4785 61
Asia Manufacturing: Hengqiao Road, Wujiang Economic Development Zone Suzhou, Jiangsu Province, China 215200 Phone: +86 512.82060807 Fax: +86 512.8206 0808
Website: www.kester.com
®
Technical Data Sheet
Health and Safety
This product, during handling or use, may be hazardous to your health or the environment. Read the Safety Data Sheet
(SDS) and warning label before using this product.
Storage and Shelf Life
Storage must be in a dry, non-corrosive environment. The surface may lose its shine and appear a dull shade of gray.
This is a surface phenomena and is not detrimental to product functionality. Flux-cored solder wire has a limited shelf life
determined by the alloy used in the wire. For alloys containing more than 70% lead, the shelf life is 2 years from the date
of manufacture. Other alloys have a shelf life of 3 years from the date of manufacture.
Cleaning
44 possesses excellent uxing ability; the ux residues are non-corrosive, non-conductive, and do not require removal for
most applications under normal conditions of use. IPA will not clean the residues off the surface of the circuit board after
the soldering process. If removal is required, a saponier or cleaning agent specically designed to clean a no-clean ux
is required to clean the residues. Please contact Kester Technical Support for further information.
Application Notes
Availability
44 ux-cored wire is available in a wide variety of alloys, wire diameters, ux percentages and roll sizes in both leaded
and lead-free alloys. The most common alloys are Sn63Pb37 and Sn60Pb40. Please refer to www.kester.com for more
information.
Note: Core size 50, 58 and 66 = 1.1%, 2.2% and 3.3% ux core, respectively.
Process Considerations
Solder iron tip temperatures are most commonly between 315-343°C (600-650°F) for leaded alloys and 371-400°C (700-
750°F) for lead-free alloys. Heat both the land area and component lead to be soldered with the iron tip prior to applying
the solder wire to land area or component lead. Do not apply the wire directly to the soldering iron tip; doing so will shorten
the life of the soldering tip.
Additional liquid ux should only be used as a last resort. Any ux applied to the solder location should be kept to the area
of the connection being reworked. If needed, Kester 186 or Kester NF372-TB may be used as a compatible liquid uxes
to aid in reworking soldered joints. Kester 186 and Kester NF372-TB are also available in Flux-Pens
®
for optimum board
cleanliness.
Global Headquarters: 800 West Thorndale Avenue, Itasca, IL USA 60143 Phone: +1 800.2.KESTER Fax: +1 630.616.4044
Asia-Pacific Headquarters: 61 Ubi Avenue 1 #06-01 UB Point, Singapore 408941 Phone: +65 6.449.1133 Fax: +65 6.242.9036
European Headquarters: Ganghofer Strasse 45, 82216 Gernlinden, Germany Phone: +49 (0) 8142 4785 0 Fax: +49 (0) 8142 4785 61
Asia Manufacturing: Hengqiao Road, Wujiang Economic Development Zone Suzhou, Jiangsu Province, China 215200 Phone: +86 512.82060807 Fax: +86 512.8206 0808
Website: www.kester.com
®

92-6040-0027

Mfr. #:
Manufacturer:
Kester
Description:
Solder Sn60Pb40 3.3/44 WIRE .031 500g SPL
Lifecycle:
New from this manufacturer.
Delivery:
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