Data Sheet ADA4310-1
Rev. B | Page 5 of 14
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
Supply Voltage
10-Lead MINI_SO_EP 12 V
16-Lead LFCSP ±6V
Power Dissipation (T
JMAX
− T
A
)/θ
JA
Storage Temperature Range −65°C to +125°C
Operating Temperature Range −40°C to +85°C
Lead Temperature (Soldering 10 sec) 300°C
Junction Temperature 150°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, θ
JA
is
specified for device soldered in circuit board for surface-mount
packages.
Table 3.
Package Type θ
JA
Unit
10-Lead MINI_SO_EP 44 °C/W
16-Lead LFCSP 63 °C/W
Maximum Power Dissipation
The maximum safe power dissipation for the ADA4310-1 is
limited by the associated rise in junction temperature (T
J
) on
the die. At approximately 150C, which is the glass transition
temperature, the plastic changes its properties. Even temporarily
exceeding this temperature limit can change the stresses that the
package exerts on the die, permanently shifting the parametric
performance of the amplifiers. Exceeding a junction temperature of
150°C for an extended period can result in changes in silicon
devices, potentially causing degradation or loss of functionality.
Figure 4 shows the maximum safe power dissipation in the
package vs. the ambient temperature for the 10-lead MINI_SO_EP
(44°C/W) and for the 16-lead LFCSP (63°C/W) on a JEDEC
standard 4-layer board. θ
JA
values are approximations.
AMBIENT TEMPERATURE (°C)
MAXIMUM POWER DISSIPATION (W)
06027-016
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
–35 –15 5 25 45 65 85
LFCSP_VQ-16
MINI_SO_EP-10
Figure 4. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
ESD CAUTION