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1
Application Note on Sample Board Operation of the
MASW-000834-13560T T/R Switch
M/A-COM Products
REV.3
MASW-000834-000SMB Sample Board
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information
contained herein without notice. M/A-COM makes no warranty, representation or guarantee
regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any
liability whatsoever arising out of the use or application of any product(s) or information.
The following is an application guide for utiliza-
tion of the MASW-000834-13560T in conjunc-
tion with a supplied sample board from M/
ACOM. The guide will review the operation of
the T/R using a single positive supply as well as
other optional dual polarity supplies.
The MASW-000834-13560T is a T/R switch
with two PIN diodes in series in a common an-
ode configuration and one PIN diode in shunt on
the Rx path. The switch die along with select
matching components are mounted in a standard
4mm MLP 16 lead package (Figure 1). The
switch die utilizes M/ACOM’s patented
HMIC process. The backside of the switch die
is thermally grounded while electrically iso-
lated. The excellent power handling of the die is
achieved through specific techniques using
unique thermal conductive epoxy embedded in
the die. This allows the heat to be transferred
from the series connected device to ground
while maintaining electrical isolation. The large
backside of the pad of the package is both
thermal and electrical ground. Figure 2 shows
the electrical/ thermal schematic of the device.
The sample board is made of Rogers RO4350
material 10mils thick dielectric with added lay-
ers to increase the board thickness to 62mils for
handling, rigidity and connector mounting.
There are on-board bias networks incorporated
to accommodate biasing the device without the
use of expensive external bias tees. Figure 3
shows the standard board layout with compo-
nent selection for optimized performance up to 6
GHz.
Figure 1. Package Outline Drawing
Figure 2. Electrical/Thermal Schematic
