PDTA124X_SER_8 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 08 — 3 September 2009 3 of 12
NXP Semiconductors
PDTA124X series
PNP resistor-equipped transistors; R1 = 22 k, R2 = 47 k
3. Ordering information
[1] Also available in SOT54A and SOT54 variant packages (see Section 2 and Section 9)
4. Marking
[1] * = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
Table 4. Ordering information
Type number Package
Name Description Version
PDTA124XE SC-75 plastic surface mounted package; 3 leads SOT416
PDTA124XEF SC-89 plastic surface mounted package; 3 leads SOT490
PDTA124XK SC-59A plastic surface mounted package; 3 leads SOT346
PDTA124XM SC-101 leadless ultra small plastic package; 3 solder lands;
body 1.0 × 0.6 × 0.5 mm
SOT883
PDTA124XS
[1]
SC-43A plastic single-ended leaded (through hole) package;
3 leads
SOT54
PDTA124XT - plastic surface mounted package; 3 leads SOT23
PDTA124XU SC-70 plastic surface mounted package; 3 leads SOT323
Table 5. Marking codes
Type number Marking code
[1]
PDTA124XE 31
PDTA124XEF 31
PDTA124XK 44
PDTA124XM DK
PDTA124XS TA124X
PDTA124XT *47
PDTA124XU *44
PDTA124X_SER_8 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 08 — 3 September 2009 4 of 12
NXP Semiconductors
PDTA124X series
PNP resistor-equipped transistors; R1 = 22 k, R2 = 47 k
5. Limiting values
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] Reflow soldering is the only recommended soldering method.
[3] Device mounted on an FR4 PCB with 60 µm copper strip line, standard footprint.
Table 6. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
CBO
collector-base voltage open emitter - 50 V
V
CEO
collector-emitter voltage open base - 50 V
V
EBO
emitter-base voltage open collector - 7V
V
I
input voltage
positive - +7 V
negative - 40 V
I
O
output current (DC) - 100 mA
I
CM
peak collector current - 100 mA
P
tot
total power dissipation T
amb
25 °C
SOT416
[1]
- 150 mW
SOT490
[1][2]
- 250 mW
SOT346
[1]
- 250 mW
SOT883
[2][3]
- 250 mW
SOT54
[1]
- 500 mW
SOT23
[1]
- 250 mW
SOT323
[1]
- 200 mW
T
stg
storage temperature 65 +150 °C
T
j
junction temperature - 150 °C
T
amb
ambient temperature 65 +150 °C
PDTA124X_SER_8 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 08 — 3 September 2009 5 of 12
NXP Semiconductors
PDTA124X series
PNP resistor-equipped transistors; R1 = 22 k, R2 = 47 k
6. Thermal characteristics
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Reflow soldering is the only recommended soldering method.
[3] Device mounted on an FR4 PCB with 60 µm copper strip line, standard footprint.
7. Characteristics
Table 7. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-a)
thermal resistance from
junction to ambient
in free air
SOT416
[1]
- - 833 K/W
SOT490
[1][2]
- - 500 K/W
SOT346
[1]
- - 500 K/W
SOT883
[2][3]
- - 500 K/W
SOT54
[1]
- - 250 K/W
SOT23
[1]
- - 500 K/W
SOT323
[1]
- - 625 K/W
Table 8. Characteristics
T
amb
=25
°
C unless otherwise specified
Symbol Parameter Conditions Min Typ Max Unit
I
CBO
collector-base cut-off
current
V
CB
= 50 V; I
E
=0A - - 100 nA
I
CEO
collector-emitter cut-off
current
V
CE
= 30 V; I
B
=0A - - 1 µA
V
CE
= 30 V; I
B
=0A;
T
j
= 150 °C
--50 µA
I
EBO
emitter-base cut-off
current
V
EB
= 5 V; I
C
=0A - - 120 µA
h
FE
DC current gain V
CE
= 5 V; I
C
= 5mA 80 - -
V
CEsat
collector-emitter
saturation voltage
I
C
= 10 mA;
I
B
= 0.5 mA
--150 mV
V
I(off)
off-state input voltage V
CE
= 5 V; I
C
= 100 µA- 0.8 0.5 V
V
I(on)
on-state input voltage V
CE
= 0.3 V; I
C
= 2mA 2 1.1 - V
R1 bias resistor 1 (input) 15.4 22 28.6 k
R2/R1 bias resistor ratio 1.7 2.1 2.6
C
c
collector capacitance V
CB
= 10 V; I
E
=i
e
=0A;
f=1MHz
--3pF

PDTA124XM,315

Mfr. #:
Manufacturer:
Nexperia
Description:
Bipolar Transistors - Pre-Biased TRANS RET TAPE-7
Lifecycle:
New from this manufacturer.
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