• Use a standard pick-and-place process and equipment. Do not use a hand
soldering process.
• Do not use a screw-down or stacking to mount the PCB into an enclosure. These
methods could bend the PCB, which would put stress on the package.
3.3 Halogen Content
This package is designed to be Halogen Free, exceeding most industry and customer
standards. Halogen Free means that no homogeneous material within the assembly
package shall contain chlorine (Cl) in excess of 700 ppm or 0.07% weight/weight or
bromine (Br) in excess of 900 ppm or 0.09% weight/weight.
4 Package Information
The FXLN83xxQ device uses a 12-lead QFN package, case number 2300-01.
4.1 Device Marking
Top View
263
P3XX
ALYW
Traceability date code
Assembly site
Lot code
Work week
Part number
P3XX
Freescale code
P = Prototype, 8 = Production
71, 72, 61, or 62
Figure 6. Device Marking Description
Package Information
Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0,
7/2014.
13
Freescale Semiconductor, Inc.
