CM1454-08CP

CM1454
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4
Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)
Symbol
Parameter Conditions Min Typ Max Units
R Resistance 80 100 120
W
C
1
Capacitance 2.5 V dc; 1 MHz, 30 mV ac 24 30 36 pF
L Inductance 3.0 nH
R
E
Equivalent Series Resistance of Inductor 0.25
W
C
2
Capacitance
0 V dc, 1 MHz, 30 mV ac; 100 125 150 pF
2.5 V dc, 1 MHz, 30 mV ac; 64 80 96 pF
f
RC
Cutoff Frequency
Z
SOURCE
= 50 W, Z
LOAD
= 50 W
60 MHz
f
LC
Cutoff Frequency
Z
SOURCE
= 50 W, Z
LOAD
= 50 W
21 MHz
V
ST
Standoff Voltage
I = 10 mA
6.0 V
I
LEAK
Diode Leakage Current V
IN
= 3.3 V 0.1 1.0
mA
V
SIG
Signal Clamp Voltage
Positive Clamp
Negative Clamp
I
LOAD
= 10 mA
I
LOAD
= 10 mA
5.6
1.5
6.8
0.8
9.0
0.4
V
V
ESD
Insystem ESD Withstand Voltage
a) Human Body Model, MILSTD883, Method 3015
b) Contact Discharge per IEC 6100042 Level 4
(Notes 2 and 3)
±30
±15
kV
R
DYN
Dynamic Resistance
Positive
Negative
2.3
0.9
W
1. T
A
= 25°C unless otherwise specified.
2. ESD applied to input and output pins with respect to GND, one at a time.
3. Unused pins are left open.
PERFORMANCE INFORMATION
Diode Characteristics (nominal conditions unless specified otherwise)
Figure 2. Typical Diode Capacitance vs. Input Voltage
(normalized to 2.5 VDC)
CM1454
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PERFORMANCE INFORMATION (Cont’d)
Typical Filter Performance (nominal conditions unless specified otherwise, 50 W Environment)
Figure 3. Attenuation Curve for CM1454 RC Filters: 1, 2, 6, 7, and 8
Figure 4. Attenuation Curve for CM1454 RC Filters: 3, 4, and 5
CM1454
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APPLICATION INFORMATION
Table 5. PRINTED CIRCUIT BOARD RECOMMENDATIONS
Parameter Value
Pad Size on PCB 0.240 mm
Pad Shape Round
Pad Definition NonSolder Mask defined pads
Solder Mask Opening 0.290 mm Round
Solder Stencil Thickness 0.125 0.150 mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.300 mm Round
Solder Flux Ratio 50/50 by volume
Solder Paste Type No Clean
Pad Protective Finish OSP (Entek Cu Plus 106A)
Tolerance Edge To Corner Ball
±50 mm
Solder Ball Side Coplanarity
±20 mm
Maximum Dwell Time Above Liquidous 60 seconds
Maximum Soldering Temperature for Leadfree Devices using a Leadfree Solder Paste 260°C
NonSolder Mask Defined Pad
0.240 mm DIA.
Solder Stencil Opening
0.300 mm DIA.
Solder Mask Opening
0.290 mm DIA.
Figure 5. Recommended NonSolder Mask Defined Pad Illustration
Figure 6. Leadfree (SnAgCu) Solder Ball Reflow Profile
200
250
150
100
50
0 1:00.0 2:00.0 3:00.0 4:00.0
Time (minutes)
Temperature (5C)

CM1454-08CP

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
FILTER LC(PI)/RC(PI) ESD SMD
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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