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TEA1521P/N2,112

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P20
TEA152X All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 04 — 14 September 2010 13 of 20
NXP Semiconductors
TEA152x
SMPS ICs for low-power systems
13. Package outline
Fig 7. Package outline SOT97-1 (DIP8)
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
SOT97-1
99-12-27
03-02-13
UNIT
A
max.
12
b
1
(1) (1)
(1)
b
2
cD E e M
Z
H
L
mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
min.
A
max.
b
max.
w
M
E
e
1
1.73
1.14
0.53
0.38
0.36
0.23
9.8
9.2
6.48
6.20
3.60
3.05
0.2542.54 7.62
8.25
7.80
10.0
8.3
1.154.2 0.51 3.2
inches
0.068
0.045
0.021
0.015
0.014
0.009
1.07
0.89
0.042
0.035
0.39
0.36
0.26
0.24
0.14
0.12
0.010.1 0.3
0.32
0.31
0.39
0.33
0.0450.17 0.02 0.13
b
2
050G01 MO-001 SC-504-8
M
H
c
(e )
1
M
E
A
L
seating plane
A
1
w M
b
1
e
D
A
2
Z
8
1
5
4
b
E
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
pin 1 index
D
IP8: plastic dual in-line package; 8 leads (300 mil)
SOT97
-1
TEA152X All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 04 — 14 September 2010 14 of 20
NXP Semiconductors
TEA152x
SMPS ICs for low-power systems
Fig 8. Package outline SOT108-1 (SO14)
UNIT
A
max.
A
1
A
2
A
3
b
p
cD
(1)
E
(1)
(1)
eH
E
LL
p
QZywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
inches
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
8.75
8.55
4.0
3.8
1.27
6.2
5.8
0.7
0.6
0.7
0.3
8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
1.0
0.4
SOT108-1
X
w M
θ
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
e
c
L
v M
A
(A )
3
A
7
8
1
14
y
076E06 MS-012
pin 1 index
0.069
0.010
0.004
0.057
0.049
0.01
0.019
0.014
0.0100
0.0075
0.35
0.34
0.16
0.15
0.05
1.05
0.041
0.244
0.228
0.028
0.024
0.028
0.012
0.01
0.25
0.01 0.004
0.039
0.016
99-12-27
03-02-19
0 2.5 5 mm
scale
S
O14: plastic small outline package; 14 leads; body width 3.9 mm
SOT108
-1
TEA152X All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 04 — 14 September 2010 15 of 20
NXP Semiconductors
TEA152x
SMPS ICs for low-power systems
14. Abbreviations
15. Revision history
Table 7. Abbreviations
Acronym Description
BiCMOS Bipolar Complementary Metal-Oxide Semiconductor
DMOS Diffusion Metal-Oxide Semiconductor
ESR Equivalent Series Resistance
EZ-HV SOI Easy High Voltage Silicon-On-Insulator
FET Field-Effect Transistor
PWM Pulse Width Modulation
SMPS Switched Mode Power Supply
SOPS Self-Oscillating Power Supply
Table 8. Revision history
Document ID Release date Data sheet status Change notice Supersedes
TEA152X v4.0 20100914 Product data sheet - TEA152X_3
Modifications:
• Table 1 “Quick reference data” updated
• Table 4 “Limiting values” updated
TEA152X_3 20090323 Product data sheet - TEA152X_FAM_2
Modifications: • The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
• Legal texts have been adapted to the new company name where appropriate.
• The minimum value of T
amb
has changed in Table 1 and Table 4
• The minimum value of T
j
has changed in Table 4
TEA152X_FAM_2 20060125 Product data sheet - TEA152X_FAMILY_1
TEA152X_FAMILY_1 20000908 Product specification - -
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P20

TEA1521P/N2,112

Mfr. #:
Buy TEA1521P/N2,112
Manufacturer:
NXP Semiconductors
Description:
IC CTRLR SMPS OVP UVLO HV 8DIP
Lifecycle:
New from this manufacturer.
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