SMD ESD Protection Diode
Page 2
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Comchip Technology CO., LTD.
QW-JPXXX
RATING AND CHARACTERISTIC CURVES (CPDZ3V3U-HF)
20.0
25.0
30.0
0 1 2 4
3
Capacitance Between Terminals, (PF)
Reverse Voltage, (V)
Fig.5 - Capacitance Between
Terminals Characteristics
Clamping Voltage,VC (V)
Fig.3 - Clamping Voltage Vs.
Peak Pulse Current
Peak Pulse Current, IPP (A)
Power Rating, (%)
Ambient Temperature, ( °C )
0
20
40
60
80
100
120
25 50 75 100
150
0 125
Fig.2 - Power Rating Derating Curve
7.0
7.0
8.0
9.0
10.0
4.03.0
2.0
1.0
5.0
6.0
35.0
11.0
8/20us waveform
Mounting on glass epoxy PCBs
0 1 3
0.001
1.00
5
Reverse Current, (uA)
Reverse Voltage, (V)
Fig.4 - Reverse Characteristics
0.01
0.10
2 4
f=1MHz
TA=25°C
f=1MHz
TA=25°C
150°C
125°C
100°C
50°C
75°C
25°C
Time, (us)
0%
20%
40%
60%
80%
100%
0 5 15 25 3010 20
120%
Percentage of Ipp
Ta=25°C
Peak Valur Ipp
Test Waveform
parameters
tf=8us
td=20us
e
-t
td= t
Ipp/2
Fig.1 - 8/20us Peak Pulse Current
Waveform Acc. IEC 6100-4-5
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