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VND830ASP

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P17
13/17
VND830ASP
PowerSO-10™ PC Board
R
thj-amb
Vs PCB copper area in open box free air condition
PowerSO-10™ THERMAL DATA
Layout condition of R
th
and Z
th
measurements (PCB FR4 area= 58mm x 58mm, PCB thickness=2mm,
Cu thickness=35µm, Copper areas: from minimum pad lay-out to 8cm
2
).
30
35
40
45
50
55
0246810
PCB Cu heatsink area (cm^2)
RTHj_amb (°C/W)
Tj-Tamb=50°C
Obsolete Product(s) - Obsolete Product(s)
14/17
VND830ASP
Thermal fitting model of a double channel HSD
in PowerSO-10
Pulse calculation formula
Thermal Parameter
Area/island (cm
2
)0.56
R1 (°C/W) 0.15
R2 (°C/W) 0.8
R3( °C/W) 0.7
R4 (°C/W) 0.8
R5 (°C/W) 12
R6 (°C/W) 37 22
C1 (W.s/°C) 0.0006
C2 (W.s/°C) 2.10E-03
C3 (W.s/°C) 0.013
C4 (W.s/°C) 0.3
C5 (W.s/°C) 0.75
C6 (W.s/°C) 3 5
Z
THδ
R
TH
δ Z
THtp
1 δ–()+⋅=
where
δ t
p
T⁄=
PowerSO-10 Thermal Impedance Junction Ambient Single Pulse
T_amb
Pd1
C1
R4
C3 C4
R3R1 R6R5R2
C5 C6C2
Pd2
R2
C1 C2
R1
Tj_1
Tj_2
0.1
1
10
100
1000
0.0001 0.001 0.01 0.1 1 10 100 1000
Time (s)
ZTH (°C/W)
0.5 cm
2
6 cm
2
Obsolete Product(s) - Obsolete Product(s)
15/17
VND830ASP
DIM.
mm. inch
MIN. TYP MAX. MIN. TYP. MAX.
A 3.35 3.65 0.132 0.144
A (*) 3.4 3.6 0.134 0.142
A1 0.00 0.10 0.000 0.004
B 0.40 0.60 0.016 0.024
B (*) 0.37 0.53 0.014 0.021
C 0.35 0.55 0.013 0.022
C (*) 0.23 0.32 0.009 0.0126
D 9.40 9.60 0.370 0.378
D1 7.40 7.60 0.291 0.300
E 9.30 9.50 0.366 0.374
E2 7.20 7.60 0.283 300
E2 (*) 7.30 7.50 0.287 0.295
E4 5.90 6.10 0.232 0.240
E4 (*) 5.90 6.30 0.232 0.248
e 1.27 0.050
F 1.25 1.35 0.049 0.053
F (*) 1.20 1.40 0.047 0.055
H 13.80 14.40 0.543 0.567
H (*) 13.85 14.35 0.545 0.565
h 0.50 0.002
L 1.20 1.80 0.047 0.070
L (*) 0.80 1.10 0.031 0.043
α 0º 8º 0º 8º
α (*) 2º 8º 2º 8º
PowerSO-10™ MECHANICAL DATA
(*) Muar only POA P013P
DETAIL "A"
PLANE
SEATING
α
L
A1
F
A1
h
A
D
D1
= =
= =
E4
0.10 A
C
A
B
B
DETAIL "A"
SEATING
PLANE
E2
10
1
eB
HE
0.25
P095A
Obsolete Product(s) - Obsolete Product(s)
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P17

VND830ASP

Mfr. #:
Buy VND830ASP
Manufacturer:
STMicroelectronics
Description:
Power Switch ICs - Power Distribution Double Channel High-Side Drive
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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