13
AT24C01A/02/04/08/16
0180T–SEEPR–12/04
Notes: 1. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics table.
2. Available in waffle pack and wafer form; order as SL719 for wafer form. Bumped die available upon request. Please contact
Serial EEPROM Marketing.
AT24C01A Ordering Information
(1)
Ordering Code Package Operation Range
AT24C01A-10PI-2.7
AT24C01A-10SI-2.7
AT24C01A-10TI-2.7
8P3
8S1
8A2
Industrial Temperature
(–40°C to 85°C)
AT24C01A-10PI-1.8
AT24C01A-10SI-1.8
AT24C01A-10TI-1.8
8P3
8S1
8A2
Industrial Temperature
(–40°C to 85°C)
AT24C01A-10PU-2.7
AT24C01A-10PU-1.8
AT24C01A-10SU-2.7
AT24C01A-10SU-1.8
AT24C01A-10TU-2.7
AT24C01A-10TU-1.8
AT24C01A-10TSU-2.7
AT24C01A-10TSU-1.8
AT24C01AU3-10UU-2.7
AT24C01AU3-10UU-1.8
AT24C01AY1-10YU-2.7
AT24C01AY1-10YU-1.8
8P3
8P3
8S1
8S1
8A2
8A2
5TS1
5TS1
8U31
8U31
8Y1
8Y1
Lead-free/Halogen-free/
Industrial Temperature
(–40°C to 85°C)
AT24C01A-W2.7-11
(2)
AT24C01A-W1.8-11
(2)
Die Sale
Die Sale
Industrial Temperature
(–40°C to 85°C)
Package Type
8P3 8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8S1 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8A2 8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
8Y1 8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)
5TS1 5-lead, 2.90 mm x 1.60 mm Body, Plastic Thin Shrink Small Outline Package (SOT23)
8U3-1 8-ball, die Ball Grid Away Package (dBGA2)
Options
–2.7 Low-voltage (2.7V to 5.5V)
–1.8 Low-voltage (1.8V to 5.5V)
