DMP3065LVT
Document number: DS36697 Rev. 4 - 2
December 2014
© Diodes Incorporated
ADVANCE INFO R MA T I O N
Maximum Ratings P-Channel (@T
A
= +25°C, unless otherwise specified.)
Continuous Drain Current (Note 5) V
GS
= -10V
Continuous Drain Current (Note 5) V
GS
= -4.5V
Maximum Body Diode Continuous Current
Thermal Characteristics (@T
A
= +25°C, unless otherwise specified.)
Total Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient (Note 6)
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
Operating and Storage Temperature Range
Electrical Characteristics P-Channel (@T
A
= +25°C, unless otherwise specified.)
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current @T
J
= +25°C
ON CHARACTERISTICS (Note 7)
V
DS
= V
GS
, I
D
= -250μA
Static Drain-Source On-Resistance
V
GS
= -4.5V, I
D
= -3.7A
Forward Transfer Admittance
DYNAMIC CHARACTERISTICS (Note 8)
V
DS
= -15V, V
GS
= 0V,
f = 1.0MHz
Reverse Transfer Capacitance
Total Gate Charge (V
GS
= -4.5V)
Total Gate Charge (V
GS
= -10V)
V
DD
= -15V, V
GS
= -10V,
I
D
= -4.9A, R
G
= 6Ω
Notes: 5. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.