Characteristics STPS2045C-Y
4/7 Doc ID 17262 Rev 1
Figure 7. Reverse leakage current versus
reverse voltage applied
(typical values, per diode)
Figure 8. Junction capacitance versus
reverse voltage applied
(typical values, per diode)
0 5 10 15 20 25 30 35 40 45
1E-1
1E+0
1E+1
1E+2
1E+3
1E+4
5E+4
I (µA)
R
V (V)
R
T =150°C
j
T =125°C
j
T =100°C
j
T =75°C
j
T =50°C
j
T =25°C
j
12 51020 50
100
200
500
1000
C(pF)
V (V)
R
F=1MHz
V =30mV
T =25°C
OSC RMS
j
Figure 9. Forward voltage drop versus
forward current
(maximum values, per diode)
Figure 10. Thermal resistance junction to
ambient versus copper surface
under tab
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
0.1
1.0
10.0
100.0
I (A)
FM
T =125°C
(typical values)
j
T =125°C
j
T =25°C
j
V (V)
FM
0 5 10 15 20 25 30 35 40
0
10
20
30
40
50
60
70
80
S(cm²)
R (°C/W)
th(j-a)
(Epoxy printed circuit board,
copper thickness: 35 µm)
