Technical Note
13/16
BD6883GUL,BH6453GUL,BD6886GUL,BD6369GUL
www.rohm.com
2012.03 - Rev.
A
© 2012 ROHM Co., Ltd. All rights reserved.
IN
OUT, GND
CLIM
PS
VCC
140
k
100k
10k
IN
60k
140
k
25k
PS
75k
VCC
VCC
1k
CLIM
OUT
GND
VCC
I/O Circuit Diagram
PS, IN OUT, GND
VLIM
VLIM
VCC
1k
10k
OUT
GND
VCC
VCC
100k
10k
PS
IN
Fig.26 BD6883GUL I/O Circuit Diagram (Resistance values are typical ones.
Fig.27 BH6453GUL I/O Circuit Diagram (Resistance values are typical ones.
Fig.28 BD6886GUL, BD6369GUL I/O Circuit Diagram (Resistance values are typical ones.)
PS, INA, INB, SEL VM, OUTA, OUTB, PGND
VM
PGND
OUT
A
OUTB
VCC
100k
10k
PS
INA
INB
SEL
VLIM
VLIM
VCC
1k
10k
Technical Note
14/16
BD6883GUL,BH6453GUL,BD6886GUL,BD6369GUL
www.rohm.com
2012.03 - Rev.
A
© 2012 ROHM Co., Ltd. All rights reserved.
Operation Notes
1) Absolute maximum ratings
Use of the IC in excess of absolute maximum ratings, such as the applied voltage (VCC, VM) or operating temperature
range (Topr), may result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or
open mode) when such damage is suffered. A physical safety measure, such as a fuse, should be implemented when
using the IC at times where the absolute maximum ratings may be exceeded.
2) Storage temperature range (Tstg)
As long as the IC is kept within this range, there should be no problems in the IC’s performance. Conversely, extreme
temperature changes may result in poor IC performance, even if the changes are within the above range.
3) Power supply and wiring
Be sure to connect the power terminals outside the IC. Do not leave them open. Because a return current is
generated by a counter electromotive force of the motor, take necessary measures such as putting a Capacitor
between the power source and the ground as a passageway for the regenerative current. Be sure to connect a
Capacitor of proper capacitance (0.1μF to 10μF) between the power source and the ground at the foot of the IC, and
ensure that there is no problem in properties of electrolytic Capacitors such as decrease in capacitance at low
temperatures. When the connected power source does not have enough current absorbing capability, there is a
possibility that the voltage of the power source line increases by the regenerative current an exceeds the absolute
maximum rating of this product and the peripheral circuits.
Therefore, be sure to take physical safety measures such as putting a zener diode for a voltage clamp between the
power source an the ground.
4) Ground terminal and wiring
The potential at GND terminals should be made the lowest under any operating conditions. Ensure that there are no
terminals where the potentials are below the potential at GND terminals, including the transient phenomena. The
motor ground terminals PGND, and the small signal ground terminal GND are not interconnected with one another
inside the IC. It is recommended that you should isolate the large-current RNF pattern and PGND pattern from the
small-signal GND pattern, and should establish a one-point grounding at a reference point of the set, to avoid
fluctuation of small-signal GND voltages caused by voltage changes due to pattern wire resistances and large
currents. Also prevent the voltage variation of the ground wiring patterns of external components. Use short and thick
power source and ground wirings to ensure low impedance.
5) Thermal design
Use a proper thermal design that allows for a sufficient margin of the power dissipation (Pd) at actual operating
conditions.
6) Pin short and wrong direction assembly of the device.
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection error or if positive and ground power supply terminals are reversed. The IC may also be damaged if pins
are shorted together or are shorted to other circuit’s power lines.
7) Avoiding strong magnetic field
Malfunction may occur if the IC is used around a strong magnetic field.
8) ASO
Ensure that the output transistors of the motor driver are not driven under excess conditions of the absolute maximum
ratings and ASO.
9) TSD (Thermal Shut Down) circuit
If the junction temperature (Tjmax) reaches 175°C (but the BH6453GUL is 150°C), the TSD circuit will operate, and
the coil output circuit of the motor will open. There is a temperature hysterics of approximately 25°C (but the
BH6453GUL is 20°C). The TSD circuit is designed only to shut off the IC in order to prevent runaway thermal
operation. It is not designed to protect the IC or guarantee its operation. The performance of the IC’s characteristics is
not guaranteed and it is recommended that the device is replaced after the TSD is activated.
Technical Note
15/16
BD6883GUL,BH6453GUL,BD6886GUL,BD6369GUL
www.rohm.com
2012.03 - Rev.
A
© 2012 ROHM Co., Ltd. All rights reserved.
10) Testing an application board
When testing the IC on an application board, connecting a Capacitor to a pin with low impedance subjects the IC to
stress. Always discharge Capacitors after each process or step. Always turn the IC's power supply off before
connecting it to, or removing it from a jig or fixture, during the inspection process. Ground the IC during assembly
steps as an antistatic measure. Use similar precaution when transporting and storing the IC.
11) Regarding the input pin of the IC
This monolithic IC contains P
+
isolation and P substrate layers between adjacent elements to keep them isolated. P-N
junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic
diode or transistor. For example, the relation between each potential is as follows:
When GND > Pin A, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic diode and transistor.
Parasitic elements can occur inevitably in the structure of the IC. The operation of parasitic elements can result in
mutual interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic
elements operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should
not be used.
Parasitic element
Other adjacent elements
Parasitic
elements
Resistor Transistor (NPN)
N
N N
P
+
P
+
P
P substrate
GND
Pin A
N
N
P
+
P
+
P
P substrate
GND
Parasitic elements
Pin B
C
B
E
N
GND
Pin A
Parasitic
element
Pin B
E
B C
GND
Fig.29 Example of Simple IC Architecture

BD6369GUL-E2

Mfr. #:
Manufacturer:
Description:
Motor / Motion / Ignition Controllers & Drivers PNP+PNP Driver Transistor
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet