MAX9672
Maxim Integrated Products. All rights reserved. Page 4
V. Quality Assurance Information
A. Quality Assurance Contacts: Ken Wendel (Director, Reliability Engineering)
Bryan Preeshl (Managing Director of QA)
B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate: < 50 ppm
D. Sampling Plan: Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure Rate ( ) is calculated as follows:
= 1 = 1.83 (Chi square value for MTTF upper limit)
MTTF 192 x 4340 x 48 x 2
(where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV)
= 22.9 x 10
-9
= 22.9 F.I.T. (60% confidence level @ 25°C)
The following failure rate represents data collected from Maxim"s reliability monitor program. Maxim performs quarterly life test
monitors on its processes. This data is published in the Reliability Report found at http://www.maxim-ic.com/qa/reliability/monitor.
Cumulative monitor data for the S45 Process results in a FIT Rate of 0.49 @ 25C and 8.49 @ 55C (0.8 eV, 60% UCL)
B. Moisture Resistance Tests
The industry standard 85°C/85%RH or HAST testing is monitored per device process once a quarter.
C. E.S.D. and Latch-Up Testing
The DV26 die type has been found to have all pins able to withstand a transient pulse of:
HBM: +/-2500V per JEDEC JESD22-A114
CDM: +/-750V per JEDEC JESD22-C101
MM: +/-250V per JEDEC JESD22-A115
Latch-Up testing has shown that this device withstands a current of +/- 250mA and Vcc Overvoltage per JESD78.
