MAG3110
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Freescale Semiconductor, Inc. 7
2.3 Electrical characteristics
Table 6. Electrical characteristics @ VDD = 2.4 V, VDDIO = 1.8 V, T = 25°C unless otherwise noted
Parameter Test Conditions Symbol Min Typ Max Unit
Supply voltage VDD 1.95 2.4 3.6 V
Interface supply voltage VDDIO 1.62 VDD V
Supply current in ACTIVE mode ODR
(1)(2)
80 Hz, OS
(1)
= 00
1. ODR = Output Data Rate; OS = Over Sampling Ratio.
2. Please see Table 32 for all ODR and OSR setting combinations, as well as corresponding current consumption and noise levels.
I
dd
900
µA
ODR 40 Hz, OS
(3)
= 00
3. By design.
550
ODR 20 Hz, OS
(3)
= 00 275
ODR 10 Hz, OS
(3)
= 00 137.5
ODR 5 Hz, OS
(3)
= 00 68.8
ODR 2.5 Hz, OS
(3)
= 00 34.4
ODR 1.25 Hz, OS
(3)
= 00 17.2
ODR 0.63 Hz, OS = 00 8.6
Supply current drain in STANDBY mode Measurement mode off I
dd
Stby 2 µA
Digital high level input voltage
SCL, SDA VIH 0.75*VDDIO
V
Digital low level input voltage
SCL, SDA VIL 0.3* VDDIO
V
High level output voltage
INT1
I
O
= 500 µA
VOH 0.9*VDDIO
V
Low level output voltage
INT1
I
O
= 500 µA
VOL 0.1* VDDIO
V
Low level output voltage
SDA
I
O
= 500 µA
VOLS
0.1* VDDIO V
Output Data Rate (ODR) ODR 0.8*ODR ODR 1.2 *ODR Hz
Signal bandwidth BW ODR/2 Hz
Boot time from power applied to boot complete BT 1.7 ms
Turn-on time
(4)(5)
4. Time to obtain valid data from STANDBY mode to ACTIVE Mode.
5. In 80 Hz mode ODR.
CTRL_REG1[OS] = 2'b01 T
on
25 ms
Operating temperature range T
op
-40 +85 °C
MAG3110
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8 Freescale Semiconductor, Inc.
2.4 I
2
C Interface characteristics
Table 7. I
2
C slave timing values
(1)
1. All values are referred to VIH (min) and VIL (max) levels.
Parameter Symbol
I
2
C Fast Mode
Unit
Min Max
SCL clock frequency
Pullup = 1 k
 C
b
= 20 pF
f
SCL
0400kHz
Bus free time between STOP and START condition t
BUF
1.3 s
Repeated START hold time t
HD;STA
0.6 s
Repeated START setup time t
SU;STA
0.6 s
STOP condition setup time t
SU;STO
0.6 s
SDA data hold time
(2)
2. t
HD;DAT
is the data hold time that is measured from the falling edge of SCL; the hold time applies to data in transmission and the acknowledge.
t
HD;DAT
0.05
(3)
3. A device must internally provide a hold time of at least 300 ns for the SDA signal (with respect to the VIH (min) of the SCL signal) to bridge the
undefined region of the falling edge of SCL.
(4)
4. The maximum t
HD;DAT
could be must be less than the maximum of t
VD;DAT
or t
VD;ACK
by a transition time. This device may stretch the LOW
period (t
LOW
) of the SCL signal.
s
SDA valid time
(5)
5. t
VD;DAT
= time for Data signal from SCL LOW to SDA output (HIGH or LOW, depending on which one is worse).
t
VD;DAT
0.9
(4)
s
SDA valid acknowledge time
(6)
6. t
VD;ACK
= time for Acknowledgement signal from SCL LOW to SDA output (HIGH or LOW, depending on which one is worse).
t
VD;ACK
0.9
(4)
s
SDA setup time t
SU;DAT
100
(7)
7. A Fast mode I
2
C device can be used in a Standard mode I
2
C system, but the requirement t
SU;DAT
250 ns must then be met. This will
automatically be the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the LOW period of the
SCL signal, it must output the next data bit to the SDA line t
r
(max) + t
SU;DAT
= 1000 + 250 = 1250 ns (according to the Standard mode I
2
C
specification) before the SCL line is released. Also the acknowledge timing must meet this setup time.
ns
SCL clock low time t
LOW
1.3 s
SCL clock high time t
HIGH
0.6 s
SDA and SCL rise time t
r
20 + 0.1C
b
(8)
1000 ns
SDA and SCL fall time
(3) (8) (9) (10)
8. C
b
= total capacitance of one bus line in pF.
9. The maximum t
f
for the SDA and SCL bus lines is specified at 300 ns. The maximum fall time for the SDA output stage t
f
is specified at 250 ns.
This allows series protection resistors to be connected in between the SDA and the SCL pins and the SDA/SCL bus lines without exceeding
the maximum specified t
f
.
10.In Fast mode Plus, fall time is specified the same for both output stage and bus timing. If series resistors are used, designers should allow for
this when considering bus timing.
t
f
20 + 0.1C
b
(8)
300 ns
Pulse width of spikes on SDA and SCL that must be suppressed by input filter t
SP
50 ns
MAG3110
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Freescale Semiconductor, Inc. 9
Figure 5. I
2
C slave timing diagram
2.5 I
2
C pullup resistor selection
The SCL and SDA signals are driven by open-drain buffers and a pullup resistor is required to make the signals rise to the high
state. The value of the pullup resistors depends on the system I
2
C clock rate and the total capacitive load on the I
2
C bus.
Higher resistance pullups will conserve power, at the expense of a slower rise time on the SCL and SDA lines (due to the RC
time constant between the bus capacitance and the pullup resistor), and will limit the maximum I
2
C clock frequency that can be
achieved.
Lower resistance value pullup resistors consume more power, but enable higher I
2
C clock operating frequencies.
I
2
C bus capacitance consists of the sum of the parasitic device and trace capacitances present. In general, longer bus traces and
an increased number of devices lead to higher total bus capacitance and will require lower value pullup resistors to enable a given
frequency of operation.
For Standard mode operation, pullup resistor values between 5 k and 10 k are recommended as a starting point, but may
need to be lowered depending on the number of devices present on the bus and the total bus capacitance. For Fast mode
operation, pullup resistor values of 1k (or lower) may be required.

MAG3110FCR1

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Board Mount Hall Effect / Magnetic Sensors XYZ DIGITAL MAGNETOMETER
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