IXFC80N10

© 2001 IXYS All rights reserved
Symbol Test Conditions Maximum Ratings
V
DSS
T
J
= 25°C to 150°C 100 V
V
DGR
T
J
= 25°C to 150°C; R
GS
= 1 M 100 V
V
GS
Continuous ±20 V
V
GSM
Transient ±30 V
I
D25
T
C
= 25°C80A
I
L(RMS)
Lead current limit 55 A
I
DM
T
C
= 25°C, pulse width limited by T
JM
320 A
I
AR
T
C
= 25°C80A
E
AR
T
C
= 25°C50mJ
E
AS
2.5 J
dv/dt I
S
I
DM
, di/dt 100 A/µs, V
DD
V
DSS
, 5 V/ns
T
J
150°C, R
G
= 2
P
D
T
C
= 25°C 230 W
T
J
-55 ... +150 °C
T
JM
150 °C
T
stg
-55 ... +150 °C
T
L
1.6 mm (0.062 in.) from case for 10 s 300 °C
F
C
Mounting force 11..65/2.4..11 Nm/lb
V
ISOL
50/60 Hz, RMS, leads-to-tab 2500 V~
Weight 2g
Symbol Test Conditions Characteristic Values
(T
J
= 25°C, unless otherwise specified)
min. typ. max.
V
DSS
V
GS
= 0 V, I
D
= 250 µA 100 V
V
GS(th)
V
DS
= V
GS
, I
D
= 4 mA 2.0 4.0 V
I
GSS
V
GS
= ±20 V
DC
, V
DS
= 0 ±100 nA
I
DSS
V
DS
= V
DSS
T
J
= 25°C50µA
V
GS
= 0 V T
J
= 125°C1mA
R
DS(on)
V
GS
= 10 V, I
D
= I
T
12.5 m
Notes 1, 2
N-Channel Enhancement Mode
High dv/dt, Low t
rr
, HDMOS
TM
Family
G = Gate, D = Drain,
S = Source
* Patent pending
HiPerFET
TM
MOSFET IXFC 80N10 V
DSS
= 100 V
ISOPLUS220
TM
I
D25
= 80 A
Electrically Isolated Back Surface R
DS(on)
= 12.5 m
t
rr
200 ns
98852 (8/01)
G
D
S
ADVANCE TECHNICAL INFORMATION
ISOPLUS 220
TM
Features
l
Silicon chip on Direct-Copper-Bond
substrate
- High power dissipation
- Isolated mounting surface
- 2500V electrical isolation
l
Low drain to tab capacitance(<35pF)
l
Low R
DS (on)
l
Rugged polysilicon gate cell structure
l
Unclamped Inductive Switching (UIS)
rated
l
Fast intrinsic Rectifier
Applications
l
DC-DC converters
l
Battery chargers
l
Switched-mode and resonant-mode
power supplies
l
DC choppers
l
AC motor control
Advantages
l
Easy assembly: no screws or isolation
foils required
l
Space savings
l
High power density
l
Low collector capacitance to ground
(low EMI)
Isolated back surface*
IXYS MOSFETS and IGBTs are covered by one or more of the following U.S. patents: 4,835,592 4,881,106 5,017,508 5,049,961 5,187,117 5,486,715
4,850,072 4,931,844 5,034,796 5,063,307 5,237,481 5,381,025
IXYS reserves the right to change limits, test conditions, and dimensions.
Symbol Test Conditions Characteristic Values
(T
J
= 25°C, unless otherwise specified)
min. typ. max.
g
fs
V
DS
= 10 V; I
D
= I
T
Notes 1, 2 35 55 S
C
iss
4800 pF
C
oss
V
GS
= 0 V, V
DS
= 25 V, f = 1 MHz 1675 pF
C
rss
590 pF
t
d(on)
50 ns
t
r
V
GS
= 10 V, V
DS
= 0.5 V
DSS
,75ns
t
d(off)
I
D
= 0.5 I
D25
, R
G
= 2.5 (External) 95 ns
t
f
31 ns
Q
g(on)
180 nC
Q
gs
V
GS
= 10 V, V
DS
= 0.5 V
DSS
, I
D
= I
T
42 nC
Q
gd
Notes 2 75 nC
R
thJC
0.54 K/W
R
thCK
0.3 K/W
Source-Drain Diode Characteristic Values
(T
J
= 25°C, unless otherwise specified)
Symbol Test Conditions min. typ. max.
I
S
V
GS
= 0 V 80 A
I
SM
Repetitive; pulse width limited by T
JM
320 A
V
SD
I
F
= I
S
, V
GS
= 0 V, 1.5 V
Note 1
t
rr
200 ns
Q
RM
0.5 µC
I
RM
6A
I
F
= 25A
-di/dt = 100 A/µs,
V
R
= 50 V
Note: All terminals are solder plated.
1 - Gate
2 - Drain
3 - Source
ISOPLUS220 OUTLINE
Note: 1. Pulse test, t 300 µs, duty cycle d 2 %
2. I
T
= 40A
IXFC 80N10

IXFC80N10

Mfr. #:
Manufacturer:
Description:
MOSFET N-CH 100V 80A ISOPLUS220
Lifecycle:
New from this manufacturer.
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