7
FN9240.2
November 10, 2015
Operation and Adaptive Shoot-Through Protection
Designed for high speed switching, the ISL6596 MOSFET
driver controls both high-side and low-side N-Channel FETs
from one externally provided PWM signal.
A rising transition on PWM initiates the turn-off of the lower
MOSFET (see “Timing Diagram” on page 6). After a short
propagation delay [t
PDLL
], the lower gate begins to fall.
Typical fall times [t
FL
] are provided in the “Electrical
Specifications” table on page 4. Adaptive shoot-through
circuitry monitors the LGATE voltage and turns on the upper
gate following a short delay time [t
PDHU
] after the LGATE
voltage drops below ~1V. The upper gate drive then begins to
rise [t
RU
] and the upper MOSFET turns on.
A falling transition on PWM indicates the turn-off of the upper
MOSFET and the turn-on of the lower MOSFET. A short
propagation delay [t
PDLU
] is encountered before the upper gate
begins to fall [t
FU
]. The adaptive shoot-through circuitry
monitors the UGATE-PHASE voltage and turns on the lower
MOSFET a short delay time, t
PDHL
, after the upper MOSFET’s
gate voltage drops below 1V. The lower gate then rises [t
RL
],
turning on the lower MOSFET. These methods prevent both the
lower and upper MOSFETs from conducting simultaneously
(shoot-through), while adapting the dead time to the gate
charge characteristics of the MOSFETs being used.
This driver is optimized for voltage regulators with large step
down ratio. The lower MOSFET is usually sized larger
compared to the upper MOSFET because the lower
MOSFET conducts for a longer time during a switching
period. The lower gate driver is therefore sized much larger
to meet this application requirement. The 0.4 on-resistance
and 4A sink current capability enable the lower gate driver to
absorb the current injected into the lower gate through the
drain-to-gate capacitor of the lower MOSFET and help
prevent shoot through caused by the self turn-on of the lower
MOSFET due to high dV/dt of the switching node.
PWM Input and Threshold Control
A unique feature of the ISL6596 is the programmable PWM
logic threshold set by the control pin (VCTRL) voltage. The
VCTRL pin should connect to the VCC of the controller, thus
the PWM logic threshold follows with the voltage level of the
controller. For 5V applications, this pin can tie to the driver
VCC and simplify the routing.
The ISL6596 also features the adaptable tri-state PWM input.
Once the PWM signal enters the shutdown window, either
MOSFET previously conducting is turned off. If the PWM signal
remains within the shutdown window for longer than the gate
turn-off propagation delay of the previously conducting
MOSFET, the output drivers are disabled and both MOSFET
gates are pulled and held low. The shutdown state is removed
when the PWM signal moves outside the shutdown window.
The PWM rising and falling thresholds outlined in the “Electrical
Specifications” on page 4 determine when the lower and upper
gates are enabled. During normal operation in a typical
application, the PWM rise and fall times through the shutdown
window should not exceed either output’s turn-off propagation
delay plus the MOSFET gate discharge time to ~1V.
Abnormally long PWM signal transition times through the
shutdown window will simply introduce additional dead time
between turn off and turn on of the synchronous bridge’s
MOSFETs. For optimal performance, no more than 50pF
parasitic capacitive load should be present on the PWM line of
ISL6596 (assuming an Intersil PWM controller is used).
Bootstrap Considerations
This driver features an internal bootstrap diode. Simply
adding an external capacitor across the BOOT and PHASE
pins completes the bootstrap circuit.
Equation 1 helps select a proper bootstrap capacitor size:
where Q
G1
is the amount of gate charge per upper MOSFET
at V
GS1
gate-source voltage and N
Q1
is the number of
control MOSFETs. The V
BOOT_CAP
term is defined as the
allowable droop in the rail of the upper gate drive.
As an example, suppose two IRLR7821 FETs are chosen as
the upper MOSFETs. The gate charge, Q
G
, from the data
sheet is 10nC at 4.5V (V
GS
) gate-source voltage. Then the
Q
GATE
is calculated to be 22nC at VCC level. We will
assume a 200mV droop in drive voltage over the PWM
cycle. We find that a bootstrap capacitance of at least
0.110µF is required. The next larger standard value
capacitance is 0.22µF. A good quality ceramic capacitor is
recommended.
C
BOOT_CAP
Q
GATE
V
BOOT_CAP
--------------------------------------
Q
GATE
Q
G1
VCC
V
GS1
-------------------------------
N
Q1
=
(EQ. 1)
20nC
V
BOOT_CAP
(V)
C
BOOT_CAP
(µF)
2.0
1.6
1.4
1.0
0.8
0.6
0.4
0.2
0.0
0.30.0 0.1 0.2 0.4 0.5 0.6 0.90.7 0.8 1.0
Q
GATE
= 100nC
1.2
1.8
5
0
n
C
FIGURE 2. BOOTSTRAP CAPACITANCE vs BOOT RIPPLE
VOLTAGE
ISL6596
8
FN9240.2
November 10, 2015
Power Dissipation
Package power dissipation is mainly a function of the
switching frequency (F
SW
), the output drive impedance, the
external gate resistance, and the selected MOSFET’s
internal gate resistance and total gate charge. Calculating
the power dissipation in the driver for a desired application is
critical to ensure safe operation. Exceeding the maximum
allowable power dissipation level will push the IC beyond the
maximum recommended operating junction temperature of
+125°C. The maximum allowable IC power dissipation for
the SO8 package is approximately 800mW at room
temperature, while the power dissipation capacity in the DFN
package, with an exposed heat escape pad, is much higher.
See “Layout Considerations” on page 9 for thermal transfer
improvement suggestions. When designing the driver into an
application, it is recommended that the following calculation
is used to ensure safe operation at the desired frequency for
the selected MOSFETs. The total gate drive power losses
due to the gate charge of MOSFETs and the driver’s internal
circuitry and their corresponding average driver current can
be estimated with Equations 2 and 3, respectively:
where the gate charge (Q
G1
and Q
G2
) is defined at a
particular gate to source voltage (V
GS1
and V
GS2
) in the
corresponding MOSFET datasheet; I
Q
is the driver’s total
quiescent current with no load at both drive outputs; N
Q1
and N
Q2
are the number of upper and lower MOSFETs,
respectively. The I
Q
V
CC
product is the quiescent power of
the driver without capacitive load and is typically negligible.
The total gate drive power losses are dissipated among the
resistive components along the transition path. The drive
resistance dissipates a portion of the total gate drive power
losses, the rest will be dissipated by the external gate
resistors (R
G1
and R
G2
, should be a short to avoid
interfering with the operation shoot-through protection
circuitry) and the internal gate resistors (R
GI1
and R
GI2
) of
MOSFETs. Figures 3 and 4 show the typical upper and lower
gate drives turn-on transition path. The power dissipation on
the driver can be roughly estimated as:
P
Qg_TOT
P
Qg_Q1
P
Qg_Q2
I
Q
VCC++=
(EQ. 2)
P
Qg_Q1
Q
G1
VCC
2
V
GS1
----------------------------------
F
SW
N
Q1
=
P
Qg_Q2
Q
G2
VCC
2
V
GS2
----------------------------------
F
SW
N
Q2
=
(EQ. 3)
I
VCC
Q
G1
N
Q1
V
GS1
------------------------------
Q
G2
N
Q2
V
GS2
------------------------------
+



VCC F
SW
I
Q
+=
FIGURE 3. TYPICAL UPPER-GATE DRIVE TURN-ON PATH
FIGURE 4. TYPICAL LOWER-GATE DRIVE TURN-ON PATH
P
DR
P
DR_UP
P
DR_LOW
I
Q
VCC++=
(EQ. 4)
P
DR_UP
R
HI1
R
HI1
R
EXT1
+
--------------------------------------
R
LO1
R
LO1
R
EXT1
+
----------------------------------------
+



P
Qg_Q1
2
---------------------
=
P
DR_LOW
R
HI2
R
HI2
R
EXT2
+
--------------------------------------
R
LO2
R
LO2
R
EXT2
+
----------------------------------------
+



P
Qg_Q2
2
---------------------
=
R
EXT2
R
G1
R
GI1
N
Q1
-------------
+=
R
EXT2
R
G2
R
GI2
N
Q2
-------------
+=
Q1
D
S
G
R
GI1
R
G1
BOOT
R
HI1
C
DS
C
GS
C
GD
R
LO1
PHASE
VCC
UGATE
VCC
Q2
D
S
G
R
GI2R
G2
R
HI2
C
DS
C
GS
C
GD
R
LO2
GND
LGATE
ISL6596
9
FN9240.2
November 10, 2015
Application Information
MOSFET Selection
The parasitic inductances of the PCB and of the power
devices’ packaging (both upper and lower MOSFETs) can
cause serious ringing, exceeding absolute maximum rating
of the devices. The negative ringing at the edges of the
PHASE node could increase the bootstrap capacitor voltage
through the internal bootstrap diode, and in some cases, it
may overstress the upper MOSFET driver. Careful layout,
proper selection of MOSFETs and packaging can go a long
way toward minimizing such unwanted stress.
The D
2
-PAK, or D-PAK packaged MOSFETs, have large
parasitic lead inductances and are not recommended unless
additional circuits are implemented to prevent the BOOT and
PHASE pins from exceeding the device rating. Low-profile
MOSFETs, such as Direct FETs and multi-SOURCE leads
devices (SO-8, LFPAK, PowerPAK), have low parasitic lead
inductances and are preferred.
Layout Considerations
A good layout helps reduce the ringing on the switching
node (PHASE) and significantly lowers the stress applied to
the output drives. The following advice is meant to lead to an
optimized layout:
Keep decoupling loops (VCC-GND and BOOT-PHASE) as
short as possible.
Minimize trace inductance, especially on low-impedance
lines. All power traces (UGATE, PHASE, LGATE, GND,
VCC) should be short and wide, as much as possible.
Minimize the inductance of the PHASE node. Ideally, the
source of the upper and the drain of the lower MOSFET
should be as close as thermally allowable.
Minimize the current loop of the output and input power
trains. Short the source connection of the lower MOSFET
to ground as close to the transistor pin as feasible. Input
capacitors (especially ceramic decoupling) should be
placed as close to the drain of upper and source of lower
MOSFETs as possible.
In addition, for heat spreading, place copper underneath the
IC whether it has an exposed pad or not. The copper area
can be extended beyond the bottom area of the IC and/or
connected to buried power ground plane(s) with thermal
vias. This combination of vias for vertical heat escape,
extended copper plane, and buried planes improve heat
dissipation and allow the part to achieve its full thermal
potential.
Upper MOSFET Self Turn-On Effects At Startup
Should the driver have insufficient bias voltage applied, its
outputs are floating. If the input bus is energized at a high
dV/dt rate while the driver outputs are floating, because of
self-coupling via the internal C
GD
of the MOSFET, the
UGATE could momentarily rise up to a level greater than the
threshold voltage of the MOSFET. This could potentially turn
on the upper switch and result in damaging inrush energy.
Therefore, if such a situation (when input bus powered up
before the bias of the controller and driver is ready) could
conceivably be encountered, it is a common practice to
place a resistor (R
UGPH
) across the gate and source of the
upper MOSFET to suppress the Miller coupling effect. The
value of the resistor depends mainly on the input voltage’s
rate of rise, the C
GD
/C
GS
ratio, as well as the gate-source
threshold of the upper MOSFET. A higher dV/dt, a lower
C
DS
/C
GS
ratio, and a lower gate-source threshold upper
FET will require a smaller resistor to diminish the effect of
the internal capacitive coupling. For most applications, a
5k to 10k resistor is typically sufficient, not affecting
normal performance and efficiency.
The coupling effect can be roughly estimated with the
following equations, which assume a fixed linear input ramp
and neglect the clamping effect of the body diode of the
upper drive and the bootstrap capacitor. Other parasitic
components such as lead inductances and PCB
capacitances are also not taken into account. These
equations are provided for guidance purpose only.
Therefore, the actual coupling effect should be examined
using a very high impedance (10M or greater) probe to
ensure a safe design margin.
V
GS_MILLER
dV
dt
-------
RC
rss
1e
V
DS
dV
dt
-------
RC
iss
----------------------------------






=
RR
UGPH
R
GI
+=
C
rss
C
GD
=
C
iss
C
GD
C
GS
+=
(EQ. 5)
FIGURE 5. GATE TO SOURCE RESISTOR TO REDUCE
UPPER MOSFET MILLER COUPLING
VIN
Q
UPPER
D
S
G
R
GI
R
UGPH
BOOT
DU
C
DS
C
GS
C
GD
DL
PHASE
VCC
ISL6596
C
BOOT
UGATE
ISL6596

ISL6596IRZ

Mfr. #:
Manufacturer:
Renesas / Intersil
Description:
Gate Drivers SYNCHCT BUCK MSFT METAL OPTION
Lifecycle:
New from this manufacturer.
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