OMO ElectronicOMO Electronic
Expand menu
Hello, Sign inMy Account
0 Cart

MPC8306SVMACDCA

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P39P40-P42P43-P45P46-P48P49-P51P52-P54P55-P57P58-P60P61-P63P64-P66P67-P69P70-P70
MPC8306S PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 1
Freescale Semiconductor 61
Thermal
21 Thermal
This section describes the thermal specifications of the MPC8306S.
21.1 Thermal Characteristics
The following table provides the package thermal characteristics for the 369, 19 19 mm MAPBGA of
the MPC8306S.
21.1.1 Thermal Management Information
For the following sections, P
D
=(V
DD
I
DD
)+P
I/O
, where P
I/O
is the power dissipation of the I/O
drivers.
21.1.2 Estimation of Junction Temperature with Junction-to-Ambient
Thermal Resistance
An estimation of the chip junction temperature, T
J
, can be obtained from the equation:
T
J
=T
A
+(R
J
A
P
D
) Eqn. 1
where:
T
J
= junction temperature (C)
Table 55. Package Thermal Characteristics for MAPBGA
Characteristic Board type Symbol Value Unit Notes
Junction-to-ambient natural convection Single-layer board (1s) R
JA
39 °C/W 1, 2
Junction-to-ambient natural convection Four-layer board (2s2p) R
JA
24 °C/W 1, 2, 3
Junction-to-ambient (@200 ft/min) Single-layer board (1s) R
JMA
32 °C/W 1, 3
Junction-to-ambient (@200 ft/min) Four-layer board (2s2p) R
JMA
21 °C/W 1, 3
Junction-to-board — R
JB
14 °C/W 4
Junction-to-case — R
JC
9°C/W5
Junction-to-package top Natural convection
JT
2°C/W6
Notes:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
2. Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9 specification.
3. Per JEDEC JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1).
6. Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.
MPC8306S PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 1
62 Freescale Semiconductor
Thermal
T
A
= ambient temperature for the package (C)
R
JA
= junction-to-ambient thermal resistance (C/W)
P
D
= power dissipation in the package (W)
The junction-to-ambient thermal resistance is an industry standard value that provides a quick and easy
estimation of thermal performance. As a general statement, the value obtained on a single layer board is
appropriate for a tightly packed printed-circuit board. The value obtained on the board with the internal
planes is usually appropriate if the board has low power dissipation and the components are well separated.
Test cases have demonstrated that errors of a factor of two (in the quantity T
J
– T
A
) are possible.
21.1.3 Estimation of Junction Temperature with Junction-to-Board
Thermal Resistance
The thermal performance of a device cannot be adequately predicted from the junction-to-ambient thermal
resistance. The thermal performance of any component is strongly dependent on the power dissipation of
surrounding components. In addition, the ambient temperature varies widely within the application. For
many natural convection and especially closed box applications, the board temperature at the perimeter
(edge) of the package is approximately the same as the local air temperature near the device. Specifying
the local ambient conditions explicitly as the board temperature provides a more precise description of the
local ambient conditions that determine the temperature of the device.
At a known board temperature, the junction temperature is estimated using the following equation:
T
J
=T
B
+(R
J
B
P
D
) Eqn. 2
where:
T
J
= junction temperature (C)
T
B
= board temperature at the package perimeter (C)
R
JB
= junction-to-board thermal resistance (C/W) per JESD51-8
P
D
= power dissipation in package (W)
When the heat loss from the package case to the air can be ignored, acceptable predictions of junction
temperature can be made. The application board should be similar to the thermal test condition: the
component is soldered to a board with internal planes.
21.1.4 Experimental Determination of Junction Temperature
To determine the junction temperature of the device in the application after prototypes are available, the
thermal characterization parameter (
JT
) can be used to determine the junction temperature with a
measurement of the temperature at the top center of the package case using the following equation:
T
J
=T
T
+(
JT
P
D
) Eqn. 3
where:
T
J
= junction temperature (C)
MPC8306S PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 1
Freescale Semiconductor 63
Thermal
T
T
= thermocouple temperature on top of package (C)
JT
= thermal characterization parameter (C/W)
P
D
= power dissipation in package (W)
The thermal characterization parameter is measured per JESD51-2 specification using a 40 gauge type T
thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so
that the thermocouple junction rests on the package. A small amount of epoxy is placed over the
thermocouple junction and over about 1 mm of wire extending from the junction. The thermocouple wire
is placed flat against the package case to avoid measurement errors caused by cooling effects of the
thermocouple wire.
21.1.5 Heat Sinks and Junction-to-Case Thermal Resistance
In some application environments, a heat sink is required to provide the necessary thermal management of
the device. When a heat sink is used, the thermal resistance is expressed as the sum of a junction-to-case
thermal resistance and a case to ambient thermal resistance as shown in the following equation:
R
JA
=R
JC
+R
CA
Eqn. 4
where:
R
JA
= junction-to-ambient thermal resistance (C/W)
R
JC
= junction-to-case thermal resistance (C/W)
R
CA
= case-to-ambient thermal resistance (C/W)
R
JC
is device related and cannot be influenced by the user. The user controls the thermal environment to
change the case-to-ambient thermal resistance, R
CA
. For instance, the user can change the size of the heat
sink, the air flow around the device, the interface material, the mounting arrangement on printed-circuit
board, or change the thermal dissipation on the printed-circuit board surrounding the device.
To illustrate the thermal performance of the devices with heat sinks, the thermal performance has been
simulated with a few commercially available heat sinks. The heat sink choice is determined by the
application environment (temperature, air flow, adjacent component power dissipation) and the physical
space available. Because there is not a standard application environment, a standard heat sink is not
required.
Accurate thermal design requires thermal modeling of the application environment using computational
fluid dynamics software which can model both the conduction cooling and the convection cooling of the
air moving through the application. Simplified thermal models of the packages can be assembled using the
junction-to-case and junction-to-board thermal resistances listed in the thermal resistance table. More
detailed thermal models can be made available on request.
21.2 Heat Sink Attachment
When attaching heat sinks to these devices, an interface material is required. The best method is to use
thermal grease and a spring clip. The spring clip should connect to the printed-circuit board, either to the
board itself, to hooks soldered to the board, or to a plastic stiffener. Avoid attachment forces which would
lift the edge of the package or peel the package from the board. Such peeling forces reduce the solder joint
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P39P40-P42P43-P45P46-P48P49-P51P52-P54P55-P57P58-P60P61-P63P64-P66P67-P69P70-P70

MPC8306SVMACDCA

Mfr. #:
Buy MPC8306SVMACDCA
Manufacturer:
NXP / Freescale
Description:
Microprocessors - MPU E300 MP 200
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet