LTC3429ES6#TRPBF

LTC3429/LTC3429B
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Thermal Shutdown
An internal temperature monitor will start to reduce the
peak current limit if the die temperature exceeds 125°C. If
the die temperature continues to rise and reaches 160°C,
the part will go into thermal shutdown, all switches will be
turned off and the soft-start capacitor will be reset. The
part will be enabled again when the die temperature drops
by about 15°C.
Burst Mode OPERATION (LTC3429 Only)
Portable devices frequently spend extended time in low
power or standby mode, only switching to high power
consumption when specific functions are enabled. To
improve battery life in these types of products, it is
important to maintain a high power conversion efficiency
over a wide output power range. The LTC3429 provides
automatic Burst Mode operation to increase efficiency of
the power converter at light loads. Burst Mode operation
is initiated if the output load current falls below an inter-
nally programmed threshold. This threshold has an in-
verse dependence on the duty cycle of the converter and
also the value of the external inductor (See Typical Perfor-
mance Characteristics, Output Current Burst Mode Thresh-
old vs V
IN
). Once Burst Mode operation is initiated, only
the circuitry required to monitor the output is kept alive
and the rest of the device is turned off. This is referred to
as the sleep state in which the IC consumes only 20µA
from the output capacitor. When the output voltage droops
by about 1% from its nominal value, the part wakes up and
commences normal PWM operation. The output capacitor
recharges and causes the part to re-enter the sleep state
if the output load remains less than the Burst Mode
threshold. The frequency of this intermittent PWM or
burst operation depends on the load current; that is, as the
load current drops further below the burst threshold, the
LTC3429 turns on less frequently. When the load current
increases above the burst threshold, the LTC3429
seamlessly resumes continuous PWM operation. Thus,
Burst Mode operation maximizes the efficiency at very
light loads by minimizing switching and quiescent losses.
However, the output ripple typically increases to about 2%
peak-to-peak. Burst Mode ripple can be reduced, in some
circumstances, by placing a small phase-lead capacitor
(C
PL
) between V
OUT
and FB pins (refer to the Block
Diagram). However, this may adversely affect the effi-
ciency and the quiescent current requirement at light
loads. Typical values of C
PL
range from 15pF to 220pF.
OUTPUT DISCONNECT AND INRUSH LIMITING
The LTC3429/LTC3429B are designed to allow true output
disconnect by eliminating body diode conduction of the
internal PMOS rectifier. This allows V
OUT
to go to zero
volts during shutdown, drawing zero current from the
input source. It also allows for inrush current limiting at
start-up, minimizing surge currents seen by the input
supply. Note that to obtain the advantage of output discon-
nect, there must not be an external Schottky diode con-
nected between the SWITCH pin and V
OUT
.
Board layout is extremely critical to minimize voltage
overshoot on the SWITCH pin due to stray inductance.
Keep the output filter capacitor as close as possible to the
V
OUT
pin and use very low ESR/ESL ceramic capacitors
tied to a good ground plane. For applications with V
OUT
over 4.3V, a Schottky diode is required to limit the peak
SWITCH voltage to less than 6V unless some form of
external snubbing is employed. This diode must also be
placed very close to the pins to minimize stray inductance.
See the Applications Information.
SHORT CIRCUIT PROTECTION
Unlike most boost converters, the LTC3429/LTC3429B
allow their output to be short circuited due to the output dis-
connect feature. The devices incorporate internal features
such as current limit foldback, thermal regulation and ther-
mal shutdown for protection from an excessive overload
or short circuit. In the event of a short circuit, the internal
soft-start capacitor gets partially discharged. This, in turn,
causes the maximum current limit to foldback to a smaller
value. In addition to this, a thermal regulation circuit starts
to dial back the current limit farther if the die temperature
rises above 125°C. If the die temperature still reaches
160°C, the device shuts off entirely.
V
IN
> V
OUT
OPERATION
The LTC3429/LTC3429B will maintain voltage regulation
even if the input voltage is above the output voltage. This
OPERATIO
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LTC3429/LTC3429B
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APPLICATIO S I FOR ATIO
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is achieved by terminating the switching of the synchro-
nous PMOS and applying V
IN
statically on its gate. This
ensures that the slope of the inductor current will reverse
during the time current is flowing to the output. Since the
PMOS no longer acts as a low impedance switch in this
mode, there will be more power dissipation within the IC.
This will cause a sharp drop in the efficiency (see Typical
Performance Characteristics, Efficiency vs V
IN
). The maxi-
mum output current should be limited in order to maintain
an acceptable junction temperature.
OPERATIO
U
PCB LAYOUT GUIDELINES
The high speed operation of the LTC3429/LTC3429B
demands careful attention to board layout. You will not get
advertised performance with careless layout. Figure 2
shows the recommended component placement. A large
ground pin copper area will help to lower the chip tempera-
ture. A multilayer board with a separate ground plane is
ideal, but not absolutely necessary.
inductor ripple current. Increasing the inductance above
10µH will increase size while providing little improvement
in output current capability.
The approximate output current capability of the LTC3429
versus inductance value is given in the equation below and
illustrated graphically in Figure 3.
II
VD
fL
D
OUT MAX P
IN
()
•–
••
•–=
()
η
2
1
where:
η = estimated efficiency
I
P
= peak current limit value (0.6A)
V
IN
= input (battery) voltage
D = steady-state duty ratio = (V
OUT
– V
IN
)/V
OUT
f = switching frequency (500kHz typical)
L = inductance value
INDUCTANCE (µH)
3
OUTPUT CURRENT (mA)
120
160
200
19
3429 F03
80
40
100
140
180
60
20
0
75
119
15 17 21
13
23
V
IN
= 1.2V
V
OUT
= 3.3V
V
OUT
= 5V
Figure 3. Maximum Output Current vs
Inductance Based on 90% Efficiency
SW
GND
FB
1
2
3
6
5
4
V
IN
V
OUT
SHDN
SHDN
3429 F02
V
OUT
V
IN
RECOMMENDED COMPONENT PLACEMENT. TRACES
CARRYING HIGH CURRENT ARE DIRECT. TRACE AREA AT
FB PIN IS SMALL. LEAD LENGTH TO BATTERY IS SHORT
Figure 2. Recommended Component Placement
for Single Layer Board
COMPONENT SELECTION
Inductor Selection
The
LTC3429/LTC3429B
can utilize small surface mount
and chip inductors due to its fast 500kHz switching
frequency.
Typically, a 4.7µH inductor is recommended
for most applications. Larger values of inductance will
allow greater output current capability by reducing the
LTC3429/LTC3429B
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The inductor current ripple is typically set for 20% to 40%
of the maximum inductor current (I
P
). High frequency
ferrite core inductor materials reduce frequency
depen
dent power losses compared to cheaper powdered
iron types, improving efficiency. The inductor should have
low ESR (series resistance of the windings) to reduce the
I
2
R power losses, and must be able to handle the peak
inductor current without saturating. Molded chokes and
some chip inductors usually do not have enough core to
support the peak inductor currents of 850mA seen on the
LTC3429/LTC3429B. To minimize radiated noise, use a
toroid, pot core or shielded bobbin inductor. See Table 1
for some suggested components and suppliers.
Table 1. Recommended Inductors
MAX
L DCR HEIGHT
PART (µH) m (mm) VENDOR
CDRH5D18-4R1 4.1 57 2.0 Sumida
CDRH5D18-100 10 124 2.0 www.sumida.com
CDRH3D16-4R7 4.7 105 1.8
CDRH3D16-6R8 170 1.8
CR43-4R7 4.7 109 3.5
CR43-100 10 182 3.5
CMD4D06-4R7MC 4.7 216 0.8
CMD4D06-3R3MC 3.3 174 0.8
DS1608-472 4.7 60 2.9 Coilcraft
DS1608-103 10 75 2.9 www.coilcraft.com
DO1608C-472 4.7 90 2.9
D52LC-4R7M 4.7 84 2.0 Toko
D52LC-100M 10 137 2.0 www.tokoam.com
LQH32CN4R7M24 4.7 195 2.2 Murata
www.murata.com
Output and Input Capacitor Selection
Low ESR (equivalent series resistance) capacitors should
be used to minimize the output voltage ripple. Multilayer
ceramic capacitors are an excellent choice as they have
extremely low ESR and are available in small footprints. A
4.7µF to 15µF output capacitor is sufficient for most
applications. Larger values up to 22µF may be used to
obtain extremely low output voltage ripple and improve
transient response. An additional phase lead capacitor
may be required with output capacitors larger than 10µF
to maintain acceptable phase margin. X5R and X7R
dielectric materials are preferred for their ability to main-
tain capacitance over wide voltage and temperature ranges.
Low ESR input capacitors reduce input switching noise
and reduce the peak current drawn from the battery. It
follows that ceramic capacitors are also a good choice for
input decoupling and should be located as close as pos-
sible to the device. A 10µF input capacitor is sufficient for
virtually any application. Larger values may be used with-
out limitations. Table 2 shows a list of several ceramic
capacitor manufacturers. Consult the manufacturers di-
rectly for detailed information on their entire selection of
ceramic capacitors.
Table 2. Capacitor Vendor Information
SUPPLIER WEBSITE
AVX www.avxcorp.com
Murata www.murata.com
Taiyo Yuden www.t-yuden.com
APPLICATIO S I FOR ATIO
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LTC3429ES6#TRPBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
Switching Voltage Regulators 600mA, 500kHz Synch Boost Converter w/ Output in ThinSOT
Lifecycle:
New from this manufacturer.
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