–4–
AD9945
TIMING SPECIFICATIONS
Parameter Symbol Min Typ Max Unit
SAMPLE CLOCKS
DATACLK, SHP, SHD Clock Period t
CONV
25 ns
DATACLK High/Low Pulse Width t
ADC
10 12.5 ns
SHP Pulse Width t
SHP
6.25 ns
SHD Pulse Width t
SHD
6.25 ns
CLPOB Pulse Width* t
COB
2 20 Pixels
SHP Rising Edge to SHD Falling Edge t
S1
6.25 ns
SHP Rising Edge to SHD Rising Edge t
S2
11.25 12.5 ns
Internal Clock Delay t
ID
3ns
DATA OUTPUTS
Output Delay t
OD
9.5 ns
Pipeline Delay 10 Cycles
SERIAL INTERFACE
Maximum SCK Frequency f
SCLK
10 MHz
SL to SCK Setup Time t
LS
10 ns
SCK to SL Hold Time t
LH
10 ns
SDATA Valid to SCK Rising Edge Setup t
DS
10 ns
SCK Falling Edge to SDATA Valid Hold t
DH
10 ns
*Minimum CLPOB pulse width is for functional operation only. Wider typical pulses are recommended to achieve low noise clamp performance.
Specifications subject to change without notice.
(C
L
= 20 pF, f
SAMP
= 40 MHz, CCD Mode Timing in Figures 8 and 9, Serial Timing in Figures 4 and 5.)
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
AD9945 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended
to avoid performance degradation or loss of functionality.
ABSOLUTE MAXIMUM RATINGS*
With
Respect
Parameter To Min Max Unit
AVDD AVSS –0.3 +3.9 V
DVDD DVSS –0.3 +3.9 V
DRVDD DRVSS –0.3 +3.9 V
Digital Outputs DRVSS –0.3 DRVDD + 0.3 V
SHP, SHD, DATACLK DVSS –0.3 DVDD + 0.3 V
CLPOB, PBLK DVSS –0.3 DVDD + 0.3 V
SCK, SL, SDATA DVSS –0.3 DVDD + 0.3 V
REFT, REFB, CCDIN AVSS –0.3 AVDD + 0.3 V
Junction Temperature 150 °C
Lead Temperature 300 °C
(10 sec)
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions outside of those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum ratings
for extended periods may affect device reliability.
THERMAL CHARACTERISTICS
Thermal Resistance
32-Lead LFCSP Package
θ
JA
= 27.7 °C/W
REV.
C
